Patents by Inventor Eric Gilley

Eric Gilley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder paste transfer process
    Patent number: 8770462
    Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: July 8, 2014
    Assignee: Raytheon Company
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley
  • SOLDER PASTE TRANSFER PROCESS
    Publication number: 20130240610
    Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
    Type: Application
    Filed: March 14, 2012
    Publication date: September 19, 2013
    Applicant: RAYTHEON COMPANY
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley
  • Solder paste transfer process
    Patent number: 8534533
    Abstract: A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: September 17, 2013
    Assignee: Raytheon Company
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley
  • SOLDER PASTE TRANSFER PROCESS
    Publication number: 20130186946
    Abstract: A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.
    Type: Application
    Filed: January 19, 2012
    Publication date: July 25, 2013
    Applicant: RAYTHEON COMPANY
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley