Patents by Inventor Eric Gongora

Eric Gongora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bridge stack integrated circuit package system
    Patent number: 7994619
    Abstract: An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier in an offset face-to-face configuration, and connecting the first device and the second device at an overlap.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: August 9, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Richard P. Sheridan, Eric Gongora, Douglas J. Mathews
  • BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20080111222
    Abstract: An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier in an offset face-to-face configuration, and connecting the first device and the second device at an overlap.
    Type: Application
    Filed: November 1, 2006
    Publication date: May 15, 2008
    Applicant: STATS CHIPPAC LTD.
    Inventors: Richard P. Sheridan, Eric Gongora, Douglas J. Matthews