Patents by Inventor Eric Graf

Eric Graf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components
    Patent number: 9318350
    Abstract: An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: April 19, 2016
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventors: Deepak Keshav Pai, Melvin Eric Graf
  • Method and Apparatus for Converting Commerical Off-The-Shelf (COTS) Thin Small-Outline Package (TSOP) Components Into Rugged Off-The-Shelf (ROTS) Components
    Publication number: 20140131307
    Abstract: An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.
    Type: Application
    Filed: July 8, 2013
    Publication date: May 15, 2014
    Inventors: Deepak Keshav Pai, Melvin Eric Graf
  • Low profile compliant leads
    Patent number: 8481862
    Abstract: The present invention relates to a connector system for resiliently attaching and electrically connecting an integrated circuit chip to a circuit board using a plurality of leads. Each of the plurality of leads are sized and arranged to form a curved body having a first leg and a second leg with a curved portion between the first leg and the second leg. The curved body of the leads may be C-shaped in accordance with the present invention. The plurality of leads may be formed from strips of copper foil or copper mesh folded to form the curved body. The plurality of leads may also be sized and arranged to support the integrated circuit chip in a generally flat arrangement relative to the circuit board with a maximum separation of about 0.016 inches or less between the integrated circuit chip and the circuit board.
    Type: Grant
    Filed: February 9, 2006
    Date of Patent: July 9, 2013
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventors: Deepak K. Pai, Melvin Eric Graf
  • Diselenobis-benzoic acid amides of primary and secondary amines and processes for the treatment of diseases in humans caused by a cell injury
    Patent number: 4873350
    Abstract: The present invention relates to new diselenobis-benzoic acid amides of primary and secondary amines of the general formula (I): ##STR1## and processes for the treatment of diseases in humans caused by a cell injury.
    Type: Grant
    Filed: October 3, 1988
    Date of Patent: October 10, 1989
    Assignee: A Nattermann & CIE GmbH
    Inventors: Andre Welter, Harmut Fischer, Leon Christiaens, Albrecht Wendel, Eugen Etschenberg, Norbert Dereu, Peter Kuhl, Eric Graf