Patents by Inventor Eric Grobelny

Eric Grobelny has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260031898
    Abstract: An aircraft satellite communication terminal includes a modem to receive data packets from an aircraft on-board network, encode the data packets, and convert the encoded data packets to intermediate frequency signaling. The terminal includes an upconverter circuit that receives the intermediate frequency signaling and upconverts to satellite carrier frequency signaling. The terminal includes a satellite antenna aperture configured to receive the satellite carrier frequency signaling and transmit the satellite carrier frequency signaling for receipt by a satellite. The terminal includes power measurement circuits configured to measure power at inputs and/or outputs of the terminal components.
    Type: Application
    Filed: July 26, 2024
    Publication date: January 29, 2026
    Inventors: Eric GROBELNY, Martin MATURA
  • Patent number: 8987066
    Abstract: A processing unit comprises a plurality of individual integrated circuits (ICs) electrically connected to one another via a common configuration of electrical interconnects (e.g., through-silicon vias). At least two of the ICs may be configured for a different function. In some examples, the processing unit is formed by selecting the ICs from stored groups of ICs. The stored ICs can be, for example, modular ICs in that the ICs can be mixed and matched in any suitable number or type in order to meet a particular set of functional requirements for the processing unit, which may depend on the application for the processing unit. Electrical coupling of these individual ICs via the electrical interconnects of the ICs results in a single processing unit that is configured to perform functions specifically suited for a particular application or set of applications.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: March 24, 2015
    Assignee: Honeywell International Inc.
    Inventors: Eric Grobelny, David Paul Campagna, David J. Kessler
  • Publication number: 20130171777
    Abstract: A processing unit comprises a plurality of individual integrated circuits (ICs) electrically connected to one another via a common configuration of electrical interconnects (e.g., through-silicon vias). At least two of the ICs may be configured for a different function. In some examples, the processing unit is formed by selecting the ICs from stored groups of ICs. The stored ICs can be, for example, modular ICs in that the ICs can be mixed and matched in any suitable number or type in order to meet a particular set of functional requirements for the processing unit, which may depend on the application for the processing unit. Electrical coupling of these individual ICs via the electrical interconnects of the ICs results in a single processing unit that is configured to perform functions specifically suited for a particular application or set of applications.
    Type: Application
    Filed: January 3, 2012
    Publication date: July 4, 2013
    Applicant: Honeywell International Inc.
    Inventors: Eric Grobelny, David Paul Campagna, David Jay Kessler