Abstract: A structure and method of fabrication are disclosed for improving surface passivation of III-V compound semiconductors. The invention exploits certain anion-rich compound semiconductors to form a high quality interface with a dielectric when anion mobility is increased during an annealing step. Low post-annealing surface state densities result in a low fixed charge density at the interface and low surface recombination velocities. The invention enables microelectronic devices including diode, transistor, solar cell, photodetector, and CCDs with superior performance wherever prior art devices have inferior surface passivation.

Abstract: The invention provides a means of enhancing the dynamic range and linearity of photodetectors and imaging photodetector arrays. This is achieved by combining Geiger mode avalanche photodiodes (APDs) capable of high efficiency detection of single photons and conventional semiconductor photodetectors with poor noise floors to simultaneously achieve high efficiency detection of single photons and a wide dynamic range.

Abstract: Certain compound semiconductor materials can be formed with nearly metal-like conductivity, while retaining the crystalline structure, high mobilities, and high carrier velocities of conventional semiconductors. Such bulk and thin-film states of matter, method of creating them, devices formed therefrom, and applications benefiting from said devices and states of matter are disclosed herein.

Abstract: This disclosure describes a structure for transistor devices formed from compound semiconductor materials; and particularly for heterojuntion bipolar transistors (HBTs); and more particularly for the collector structure of a double HBT (DHBT). The invention enables high output power at high frequency operation, of high frequency operation at high output power.

Abstract: This disclosure describes a structure for transistor devices formed from compound semiconductor materials; and particularly for heterojunction bipolar transistors (HBTs); and more particularly for the collector structure of a double HBT (DHBT). The invention enables high output power at high frequency operation, or high frequency operation at high output power.

Abstract: The invention, called hypercontacting, achieves a very high level of activated doping at an exposed surface region of a compound semiconductor. This enables production of low resistance ohmic contacts by creating a heavily doped region near the contact. Such region lowers the contact's tunneling barrier by decreasing the extent of the depletion region at the contact, thereby reducing resistance.