Patents by Inventor ERIC HEIDEPRIEM

ERIC HEIDEPRIEM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Collar for electrically grounding a heat sink for a computer component
    Patent number: 8526185
    Abstract: To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: September 3, 2013
    Assignee: Cisco Technology, Inc.
    Inventors: Eric Heidepriem, Robert Grimes
  • COLLAR FOR ELECTRICALLY GROUNDING A HEAT SINK FOR A COMPUTER COMPONENT
    Publication number: 20120092826
    Abstract: To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.
    Type: Application
    Filed: October 18, 2010
    Publication date: April 19, 2012
    Inventors: ERIC HEIDEPRIEM, Robert Grimes