Patents by Inventor Eric Henry Holec
Eric Henry Holec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11304308Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: GrantFiled: November 27, 2019Date of Patent: April 12, 2022Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
-
Publication number: 20200275556Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: ApplicationFiled: November 27, 2019Publication date: August 27, 2020Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
-
Patent number: 10499511Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: GrantFiled: August 14, 2017Date of Patent: December 3, 2019Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
-
Publication number: 20180063968Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: ApplicationFiled: August 14, 2017Publication date: March 1, 2018Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
-
Patent number: 9736946Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: GrantFiled: October 3, 2014Date of Patent: August 15, 2017Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
-
Publication number: 20150189765Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: ApplicationFiled: October 3, 2014Publication date: July 2, 2015Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
-
Patent number: 8851356Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: GrantFiled: June 10, 2011Date of Patent: October 7, 2014Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
-
Publication number: 20130278750Abstract: Embodiments of the invention include systems and methods relating to self-learning machine vision systems. In an embodiment, the invention includes a self-learning machine vision system including a video input; a processor in communication with the video input; and a video output in communication with the processor. The processor is configured to process video data from the video input and identify a number of repeating units within the video data. The processor is further configured to identify repeating units that deviate from the other repeating units. The system can further display an image of the repeating units through the video output with indicia to indicate identified deviant repeating units.Type: ApplicationFiled: April 19, 2013Publication date: October 24, 2013Applicant: METROSPEC TECHNOLOGY, L.L.C.Inventor: Eric Henry Holec