Patents by Inventor Eric Hertz

Eric Hertz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio reveiver
    Publication number: 20040148322
    Abstract: There is disclosed a radio receiver, a filter which may be used in a radio receiver, in which received signals are applied to a digital filter twice, with an intermediate time reversal. This has the effect that any phase distortion introduced by the filter is cancelled by the application of the time inverted signal to the filter. This means that a non-liner filter can be used. Specifically, in preferred embodiments of the invention, an IIR wave digital filter can be used, which means that the device can have lower power consumption and requires a smaller silicon area than would otherwise be the case.
    Type: Application
    Filed: March 15, 2004
    Publication date: July 29, 2004
    Inventors: Eric Hertz, Joaquin Canovas, Shousheng He, Antonio Vicent
  • Method and apparatus for placing conductive preforms
    Patent number: 6202918
    Abstract: A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: March 20, 2001
    Inventor: Eric Hertz
  • Method and apparatus for placing conductive preforms
    Patent number: 6000602
    Abstract: A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: December 14, 1999
    Inventor: Eric Hertz