Patents by Inventor Eric Hu
Eric Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250361236Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.Type: ApplicationFiled: April 25, 2024Publication date: November 27, 2025Inventors: Masaaki Sawa, Mai Arai, Ryoko Nakai, Hirokazu Matsumoto, Catherine Pugh, Eric Hu, Juan Guerrero, Jesse Jacobsen, Jonathan William Medley, Jie Xu, Latesh Lad, Leena Patel, Michael Graupe, Qingming Zhu, Stephen Holmbo, Tetsuya Kobayashi, Will Watkins, Yasamin Moazami, Suet C. Yeung, Julian A. Codelli, Heath A. Weaver
-
Publication number: 20240400568Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.Type: ApplicationFiled: April 25, 2024Publication date: December 5, 2024Inventors: Masaaki Sawa, Mai Arai, Ryoko Nakai, Hirokazu Matsumoto, Catherine Pugh, Eric Hu, Juan Guerrero, Jesse Jacobsen, Jonathan William Medley, Jie Xu, Latesh Lad, Leena Patel, Michael Graupe, Qingming Zhu, Stephen Holmbo, Tetsuya Kobayashi, Will Watkins, Yasamin Moazami, Suet C. Yeung, Julian A. Codelli, Heath A. Weaver
-
Publication number: 20240182476Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.Type: ApplicationFiled: August 16, 2023Publication date: June 6, 2024Inventors: Masaaki Sawa, Mai Arai, Ryoko Nakai, Hirokazu Matsumoto, Catherine Pugh, Eric Hu, Juan Guerrero, Jesse Jacobsen, Jonathan William Medley, Jie Xu, Latesh Lad, Leena Patel, Michael Graupe, Qingming Zhu, Stephen Holmbo, Tetsuya Kobayashi, Will Watkins, Yasamin Moazami, Suet C. Yeung, Julian A. Codelli, Heath A. Weaver
-
Patent number: 11845723Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.Type: GrantFiled: December 18, 2020Date of Patent: December 19, 2023Assignee: Gilead Sciences, Inc.Inventors: Masaaki Sawa, Mai Arai, Ryoko Nakai, Hirokazu Matsumoto, Catherine Pugh, Eric Hu, Juan Guerrero, Jesse Jacobsen, Jonathan William Medley, Jie Xu, Latesh Lad, Leena Patel, Michael Graupe, Qingming Zhu, Stephen Holmbo, Tetsuya Kobayashi, Will Watkins, Yasamin Moazami, Suet C. Yeung, Julian A. Codelli, Heath A. Weaver
-
Patent number: 11532489Abstract: A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.Type: GrantFiled: June 11, 2021Date of Patent: December 20, 2022Assignee: Dialog Semiconductor (UK) LimitedInventors: Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio
-
Publication number: 20220324866Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.Type: ApplicationFiled: December 18, 2020Publication date: October 13, 2022Inventors: Masaaki SAWA, Mai ARAI, Ryoko NAKAI, Hirokazu MATSUMOTO, Catherine PUGH, Eric HU, Juan GUERRERO, Jesse JACOBSEN, Jonathan William MEDLEY, Jie XU, Latesh LAD, Leena PATEL, Michael GRAUPE, Qingming ZHU, Stephen HOLMBO, Tetsuya KOBAYASHI, Will WATKINS, Yasamin MOAZAMI, Suet C. YEUNG, Julian A. CODELLI, Heath A. WEAVER
-
Publication number: 20210305167Abstract: A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.Type: ApplicationFiled: June 11, 2021Publication date: September 30, 2021Inventors: Ernesto Gutierrez, III, Jesus Mennen Belonio, Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio
-
Patent number: 11075167Abstract: A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.Type: GrantFiled: February 1, 2019Date of Patent: July 27, 2021Assignee: Dialog Semiconductor (UK) LimitedInventors: Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr., Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio
-
Patent number: 10903565Abstract: An antenna system includes N movable antenna elements configured to generate concurrently M receiving beams pointing respectively at M satellites radiating in a common frequency band, N and M being integers and N?M?2. A beam forming system is coupled to the N movable antenna elements and configured to shape the M receiving beams using weights inputted from a beam controller. The beam controller optimizes the M receiving beams by computing spatial displacements to spatially reposition the N movable antenna elements relative to each other, using an iterative optimization processing to satisfy a plurality of constraints concurrently. A position driver system spatially re-positions the N movable antenna elements in accordance to the spatial displacements inputted from the beam controller.Type: GrantFiled: July 29, 2019Date of Patent: January 26, 2021Assignee: SPATIAL DIGITAL SYSTEMS, INC.Inventors: Donald C. D. Chang, Tzer-Hso Lin, Eric Hu
-
Publication number: 20200251350Abstract: A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.Type: ApplicationFiled: February 1, 2019Publication date: August 6, 2020Inventors: Ernesto Gutierrez, III, Jesus Mennen Belonio, JR., Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio
-
Publication number: 20190356048Abstract: An antenna system includes N movable antenna elements configured to generate concurrently M receiving beams pointing respectively at M satellites radiating in a common frequency band, N and M being integers and N?M?2. A beam forming system is coupled to the N movable antenna elements and configured to shape the M receiving beams using weights inputted from a beam controller. The beam controller optimizes the M receiving beams by computing spatial displacements to spatially reposition the N movable antenna elements relative to each other, using an iterative optimization processing to satisfy a plurality of constraints concurrently. A position driver system spatially re-positions the N movable antenna elements in accordance to the spatial displacements inputted from the beam controller.Type: ApplicationFiled: July 29, 2019Publication date: November 21, 2019Applicant: SPATIAL DIGITAL SYSTEMS, INC.Inventors: Donald C.D. Chang, Tzer-Hso Lin, Eric Hu
-
Patent number: 10367262Abstract: An antenna system comprises: multiple antenna elements; and multiple beam forming networks configured to produce radiation patterns for both receiving and transmission functions configured to be optimized by re-positioning said antenna elements, wherein said beam forming networks comprise a receiving beam forming network configured to combine multiple first inputs from said antenna elements into at least a first output, and a transmission beam forming network configured to divide a second input into multiple second outputs to said antenna elements.Type: GrantFiled: May 20, 2016Date of Patent: July 30, 2019Assignee: SPATIAL DIGITAL SYSTEMS, INC.Inventors: Donald C. D. Chang, Tzer-Hso Lin, Eric Hu
-
Publication number: 20160268676Abstract: An antenna system comprises: multiple antenna elements; and multiple beam forming networks configured to produce radiation patterns for both receiving and transmission functions configured to be optimized by re-positioning said antenna elements, wherein said beam forming networks comprise a receiving beam forming network configured to combine multiple first inputs from said antenna elements into at least a first output, and a transmission beam forming network configured to divide a second input into multiple second outputs to said antenna elements.Type: ApplicationFiled: May 20, 2016Publication date: September 15, 2016Inventors: Donald C.D. Chang, Tzer-Hso Lin, Eric Hu
-
Patent number: 9356358Abstract: An antenna system comprises: multiple antenna elements; and multiple beam forming networks configured to produce radiation patterns for both receiving and transmission functions configured to be optimized by re-positioning said antenna elements, wherein said beam forming networks comprise a receiving beam forming network configured to combine multiple first inputs from said antenna elements into at least a first output, and a transmission beam forming network configured to divide a second input into multiple second outputs to said antenna elements.Type: GrantFiled: August 5, 2010Date of Patent: May 31, 2016Assignee: SPATIAL DIGITAL SYSTEMS, INC.Inventors: Donald C. D. Chang, Michael T. S. Lin, Eric Hu
-
Patent number: 8126172Abstract: A spatial processing stereo system (“SPSS”) that receives audio signals and a limited number of user input parameters associated with the spatial attributes of a room, such as “room size”, “stage distance”, and “stage width”. The input parameters are used to define a listening room and generate coefficients, room impulse responses, and scaling factors that are used generate additional surround signals.Type: GrantFiled: December 6, 2007Date of Patent: February 28, 2012Assignee: Harman International Industries, IncorporatedInventors: Ulrich Horbach, Eric Hu, Stefan Finauer, Yi Zeng
-
Publication number: 20110032173Abstract: The present invention relates to antenna architectures and methods on re-configurable multi-element antennas via feed re-positioning for various optimized radiation contours, including beam forming (or shaping) and/or null steering on contoured beams, spot beams, and orthogonal beams. The feed re-positioning techniques can also be used in radiation pattern optimization processing during antennas designing phases for fixed beams. The techniques are applicable for satellite communications. For satellite antennas, the beam shaping capability via element repositioning can be utilized for (1) optimized geometries on satellite antennas for given desired coverage areas, (2) re-optimizing radiation contours for reconfigurable antenna on board satellites in operation, (3) additional flexibility for satellite antennas using ground based beam forming (GBBF). As to satellite ground terminals, the same techniques are applicable for both fixed and mobile satellite terminals featuring either single beam or multiple beams.Type: ApplicationFiled: August 5, 2010Publication date: February 10, 2011Inventors: Donald C. D. Chang, Michael T. S. Lin, Eric Hu
-
Publication number: 20090147975Abstract: A spatial processing stereo system (“SPSS”) that receives audio signals and a limited number of user input parameters associated with the spatial attributes of a room, such as “room size”, “stage distance”, and “stage width”. The input parameters are used to define a listening room and generate coefficients, room impulse responses, and scaling factors that are used generate additional surround signals.Type: ApplicationFiled: December 6, 2007Publication date: June 11, 2009Applicant: Harman International Industries, IncorporatedInventors: Ulrich Horbach, Eric Hu, Stefan Finauer, Yi Zeng
-
Patent number: 6772028Abstract: A method for performing a synchronized order change in a manufacturing process is provided. An order is associated with an order number and a work in process (WIP) number, which identifies a physical lot corresponding to the order. The synchronized order change maintains a relationship between the order number and the WIP number while making the change. This avoids the need to scrap lots that are no longer associated with an order number and prevents holds from being placed on incorrect lots.Type: GrantFiled: March 26, 2003Date of Patent: August 3, 2004Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kevin Yen, Ching-Yun Chang, David Yen, Eric Hu