Abstract: A comfort control system for controlling the comfort level in a building includes a comfort control unit and a remote control unit. The remote control unit communicates with the comfort control unit from a remote location. In one illustrative embodiment, the remote control unit includes a temperature sensor for sensing an ambient air temperature near the remote control unit, and a measure related to the sensed temperature may be communicated to the comfort control unit. A detection block may be included in the remote control unit for detecting when the ambient air temperature sensed by the temperature sensor in the remote control unit is likely to be influenced by a user or other undesirable condition. The comfort control unit may take this into account when controlling the comfort control system of the building.

Abstract: An HVAC controller includes an HVAC controller housing having an aperture and a removable battery tray disposed within the aperture. The removable battery tray includes a pivot point for rotating the battery tray into and out of the aperture.

Abstract: Controller assemblies including a control unit releasably supported to a mounting plate are disclosed. An illustrative controller assembly can include a mounting plate and a control unit that can be attached together via a number of latching mechanisms and corresponding mating recesses. Each latching mechanism can include a bendable latch and a latch shroud, which together are adapted to fit within a clearance area of the mating recess. The control unit can be removed from the mounting plate by rotating the control unit away from the mounting plate via a finger grip located along an edge of the assembly. The latching mechanisms can be configured to permit the staged removal of the control unit, reducing the force required to remove the control unit from the mounting plate.

Abstract: A comfort control system for controlling the comfort level in a building includes a comfort control unit and a remote control unit. The remote control unit communicates with the comfort control unit from a remote location. In one illustrative embodiment, the remote control unit includes a temperature sensor for sensing an ambient air temperature near the remote control unit, and a measure related to the sensed temperature may be communicated to the comfort control unit. A detection block may be included in the remote control unit for detecting when the ambient air temperature sensed by the temperature sensor in the remote control unit is likely to be influenced by a user or other undesirable condition. The comfort control unit may take this into account when controlling the comfort control system of the building.

Abstract: Controller assemblies including a control unit releasably supported to a mounting plate are disclosed. An illustrative controller assembly can include a mounting plate and a control unit that can be attached together via a number of latching mechanisms and corresponding mating recesses. Each latching mechanism can include a bendable latch and a latch shroud, which together are adapted to fit within a clearance area of the mating recess. The control unit can be removed from the mounting plate by rotating the control unit away from the mounting plate via a finger grip located along an edge of the assembly. The latching mechanisms can be configured to permit the staged removal of the control unit, reducing the force required to remove the control unit from the mounting plate.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.