Patents by Inventor Eric J. Chapman

Eric J. Chapman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143806
    Abstract: Methods and systems for managing and/or processing a blockchain to maintain data security for confidential and/or personal data are provided. According to certain aspects, the disclosed data security techniques may enable access sharing functionality utilizing the blockchain. For example, access sharing may be utilized to file documents, share policy information, and/or comply with an audit. The data security techniques disclosed herein also enable the use of smart contracts to transfer funds associated with payment obligations and/or other forms of blockchain based payments, comply with anti-money laundering requirements, report industry data, validate interest payments and/or maintain agent sales data. Data security may be achieved through the use of public key/private key encryption techniques.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 2, 2024
    Inventors: Melinda Teresa Magerkurth, Eric Bellas, Jaime Skaggs, Shawn M. Call, Eric R. Moore, Vicki King, Burton J. Floyd, David Turrentine, Steven T Olson, Timothy Caleb Wells, Corin Rebekah Chapman, Edward W. Breitweiser, Robert Gomez, Shelia Cummings Smith
  • Patent number: 11960340
    Abstract: A method for controlling a data processing system includes detecting a droop in a power supply voltage of a functional circuit of the data processing system greater than a programmable droop threshold. An operation of the data processing system is throttled according to a programmable step size, a programmable assertion time, and a programmable de-assertion time in response to detecting the droop.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: April 16, 2024
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Eric J. Chapman, Stephen Victor Kosonocky, Kaushik Mazumdar, Vydhyanathan Kalyanasundharam, Samuel Naffziger, Eric M. Scott
  • Patent number: 11960339
    Abstract: A multi-die processor semiconductor package includes a first base integrated circuit (IC) die configured to provide, based at least in part on an indication of a configuration of a first plurality of compute dies 3D stacked on top of the first base IC die, a unique power domain to each of the first plurality of compute dies. In some embodiments, the semiconductor package also includes a second base IC die including a second plurality of compute dies 3D stacked on top of the second base IC die and an interconnect communicably coupling the first base IC die to the second base IC die.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: April 16, 2024
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Eric J. Chapman, Alan D. Smith, Edward Chang
  • Patent number: 11954214
    Abstract: Methods and systems for managing and/or processing a blockchain to maintain data security for confidential and/or personal data are provided. According to certain aspects, the disclosed data security techniques may enable access sharing functionality utilizing the blockchain. For example, access sharing may be utilized to share policy information. The policy information may be associated with a smart contract. Accordingly, the policy information may be encrypted using a public key for the smart contract and compiled into a block of the blockchain. In response to a request to provide access to the information to a particular node, the private key for the smart contract may be encrypted using the public key for the particular node and compiled into a block of the blockchain.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: April 9, 2024
    Assignee: STATE FARM MUTUAL AUTOMOBILE INSURANCE COMPANY
    Inventors: Melinda Teresa Magerkurth, Eric Bellas, Jaime Skaggs, Shawn M. Call, Eric R. Moore, Vicki King, Burton J. Floyd, David Turrentine, Steven T. Olson, Timothy Caleb Wells, Corin Rebekah Chapman, Edward W. Breitweiser, Robert Gomez, Shelia Cummings Smith
  • Publication number: 20240113004
    Abstract: A semiconductor package assembly includes a package interface. An interposer die has a first surface and a second surface opposite to the first surface, where the first surface of the interposer is die positioned on the package interface. The interposer die includes a plurality of conductive connections between the first surface and second surface. A chiplet includes a connectivity region having conductive pathways, with a first portion of the connectivity region coupled to a conductive connection of the interposer die and a second portion of the connectivity region cantilevered from the interposer die.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: GABRIEL H. LOH, ERIC J. CHAPMAN, RAJA SWAMINATHAN
  • Publication number: 20240111881
    Abstract: Methods and systems for processing a blockchain comprising a plurality of immutable sales records corresponding to sales made by agents of an entity are provided. According to certain aspects, a transaction request indicating a sale made by an agent of the entity may be received at a first node. A block including a sales record indicating the sale made by the agent may be added to a blockchain and transmitted to another node for validation. The first node may add the block to a copy of the blockchain, where the block may be identified by a hash value that references a previous block in the blockchain that includes at least one additional sales record.
    Type: Application
    Filed: December 7, 2023
    Publication date: April 4, 2024
    Inventors: Melinda Teresa Magerkurth, Eric Bellas, Jaime Skaggs, Shawn M. Call, Eric R. Moore, Vicki King, Burton J. Floyd, David Turentine, Steven T. Olson, Timothy Caleb Wells, Corin Rebekah Chapman, Edward W. Breitweiser, Robert Gomez, Shelia Cummings Smith
  • Patent number: 11914728
    Abstract: Methods and systems for managing and/or processing a blockchain to maintain data security for confidential and/or personal data are provided. According to certain aspects, the disclosed data security techniques may enable access sharing functionality utilizing the blockchain. For example, access sharing may be utilized to file documents, share policy information, and/or comply with an audit. The data security techniques disclosed herein also enable the use of smart contracts to transfer funds associated with payment obligations and/or other forms of blockchain based payments, comply with anti-money laundering requirements, report industry data, validate interest payments and/or maintain agent sales data. Data security may be achieved through the use of public key/private key encryption techniques.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: February 27, 2024
    Assignee: STATE FARM MUTUAL AUTOMOBILE INSURANCE COMPANY
    Inventors: Melinda Teresa Magerkurth, Eric Bellas, Jaime Skaggs, Shawn M. Call, Eric R. Moore, Vicki King, Burton J. Floyd, David Turrentine, Steven T. Olson, Timothy Caleb Wells, Corin Rebekah Chapman, Edward W. Breitweiser, Robert Gomez, Shelia Cummings Smith
  • Publication number: 20230144770
    Abstract: A method for controlling a data processing system includes detecting a droop in a power supply voltage of a functional circuit of the data processing system greater than a programmable droop threshold. An operation of the data processing system is throttled according to a programmable step size, a programmable assertion time, and a programmable de-assertion time in response to detecting the droop.
    Type: Application
    Filed: November 8, 2021
    Publication date: May 11, 2023
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Eric J. Chapman, Stephen Victor Kosonocky, Kaushik Mazumdar, Vydhyanathan Kalyanasundharam, Samuel Naffziger, Eric M. Scott
  • Publication number: 20230009881
    Abstract: A multi-die processor semiconductor package includes a first base integrated circuit (IC) die configured to provide, based at least in part on an indication of a configuration of a first plurality of compute dies 3D stacked on top of the first base IC die, a unique power domain to each of the first plurality of compute dies. In some embodiments, the semiconductor package also includes a second base IC die including a second plurality of compute dies 3D stacked on top of the second base IC die and an interconnect communicably coupling the first base IC die to the second base IC die.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 12, 2023
    Inventors: Eric J. Chapman, Alan D. Smith, Edward Chang