Patents by Inventor Eric J. Jones

Eric J. Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Superconducting device with dummy elements
    Patent number: 10291231
    Abstract: Examples described in this disclosure relate to superconducting devices, including reciprocal quantum logic (RQL) compatible devices. A superconducting device including at least one superconducting element having a first coefficient of thermal expansion is provided. The at least one superconducting element is formed on a dielectric layer having a second coefficient of thermal expansion and the first coefficient of thermal expansion is different from the second coefficient of thermal expansion causing a strain mismatch between the at least one superconducting element and the dielectric layer when the superconducting device is operating in a cryogenic environment. The superconducting device may also include at least one dummy element configured to lower stress at an interface between the at least one superconducting element and the dielectric layer when the at least one superconducting device is operating in the cryogenic environment.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: May 14, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Vivian W. Ryan, Eric J. Jones
  • SUPERCONDUCTING DEVICE WITH DUMMY ELEMENTS
    Publication number: 20180131376
    Abstract: Examples described in this disclosure relate to superconducting devices, including reciprocal quantum logic (RQL) compatible devices. A superconducting device including at least one superconducting element having a first coefficient of thermal expansion is provided. The at least one superconducting element is formed on a dielectric layer having a second coefficient of thermal expansion and the first coefficient of thermal expansion is different from the second coefficient of thermal expansion causing a strain mismatch between the at least one superconducting element and the dielectric layer when the superconducting device is operating in a cryogenic environment. The superconducting device may also include at least one dummy element configured to lower stress at an interface between the at least one superconducting element and the dielectric layer when the at least one superconducting device is operating in the cryogenic environment.
    Type: Application
    Filed: July 20, 2016
    Publication date: May 10, 2018
    Inventors: Vivian W. Ryan, Eric J. Jones