Abstract: According to one aspect, an LED package comprises a plurality of LEDs and a primary optic disposed adjacent the LEDs wherein the primary optic includes protrusions for mixing light developed by the plurality of LEDs.

Abstract: According to one aspect, a luminaire comprising a first waveguide having a first coupling surface, a second waveguide having a second coupling surface, and a coupling optic optically coupled to the first coupling surface and the second coupling surface and adapted to receive a light source. The coupling optic comprising a central coupling section, a first light distribution section, and a second light distribution section opposed to the first light distribution section, wherein each of the first and second light distribution sections includes a first surface having a curved portion and a planar portion both bounded by a second surface and a third surface. The curved portion is proximal to the central coupling section and the planar portion is distal to the central coupling section.

Abstract: A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material.

Abstract: A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material.

Abstract: An optical waveguide includes a waveguide body and a film disposed on a surface of the waveguide body. The film includes a base and a plurality of undercut light extraction elements disposed between the base and the surface.

Abstract: A waveguide body comprises a central section, first and second side sections, and a coupling portion located in the central section. Each of said side sections extend away from the central section along opposing first and second directions, respectively. The coupling portion includes an elongate coupling cavity symmetric about a plane extending in a third direction transverse to the first and second directions and configured to receive a light source. The coupling portion includes a control surface configured to collimate a portion of light emitted from the light source into at least one substantially collimated ray group. Light is emitted above and below the waveguide body. A portion of the light is emitted above and below the waveguide body at an angle other than parallel to an optical axis of the light source.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

Abstract: An LED component includes, according to a first embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an optical lens overlying the LED chips and having a lens base attached to the substrate, where the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base.

Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

Abstract: A luminaire comprises at least one waveguide having a first region that emits a first luminous intensity pattern and a second region that emits a second luminous intensity pattern different from the first luminous intensity pattern. The luminaire further includes a plurality of LED elements and circuitry to control the plurality of LED elements to cause the luminaire to produce a selected one of a plurality of luminous intensity patterns.

Abstract: A luminaire includes at least first and second waveguides. The first waveguide has a first coupling surface extending between a first surface and a second surface opposite the first surface, and the second waveguide has a second coupling surface extending between a third surface and a fourth surface opposite the third surface. The first and second coupling surfaces define a coupling cavity. The luminaire further includes at least one light source within the coupling cavity.

Abstract: A luminaire includes an optical waveguide having a first surface and a second surface opposite the first surface, and a light source associated with the optical waveguide. At least about 80% of light produced by the light source is directed by the waveguide into an illumination distribution emitted from the first surface of the optical waveguide.

Abstract: A solid state light emitting device comprising an emitter structure having an active region of semiconductor material and a pair of oppositely doped layers of semiconductor material on opposite sides of the active region. The active region emits light at a predetermined wavelength in response to an electrical bias across the doped layers. An absorption layer of semiconductor material is included that is integral to said emitter structure and doped with at least one rare earth or transition element. The absorption layer absorbs at least some of the light emitted from the active region and re-emits at least one different wavelength of light. A substrate is included with the emitter structure and absorption layer disposed on the substrate.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

Abstract: An optical waveguide includes a body of optically transmissive material having a width substantially greater than an overall thickness thereof. The body of material has a first side, a second side opposite the first side, and a plurality of interior bores extending between the first and second sides each adapted to receive a light emitting diode. Extraction features are disposed on the second side and the extraction features direct light out of at least the first side and at least one extraction feature forms a taper disposed at an outer portion of the body.

Abstract: According to one aspect, a waveguide includes a waveguide body having a coupling cavity extending therethrough and a plug member having a first portion disposed in the coupling cavity. The plug member includes an outer surface substantially conforming to the coupling cavity and a second portion extending from the first portion into the coupling cavity and a reflective surface adapted to direct light in the coupling cavity into the waveguide body.

Abstract: According to one aspect, a luminaire includes a waveguide body having an interior coupling cavity extending into a portion of the waveguide body remote from an edge thereof. The luminaire further includes an LED element extending into the interior coupling cavity having first and second sets of LEDs wherein each LED of the first set comprises a blue-shifted yellow LED and each LED of the second set comprises a red LED wherein the red LEDs are disposed between the blue-shifted yellow LEDs and wherein the blue-shifted yellow LEDs have a first height and the red LEDs have a second height less than the first height. The LED element further includes a lens disposed over the first and second sets of LEDs.