Abstract: A phase separated composite glass has a first phase and a second phase. The first phase has an average microstructure size greater than a natural coursing limit of the phase separated composite glass (i.e., outside of what would be achievable by natural phase separation or otherwise in violation of the morphology constraints defined by a liquid-liquid immiscibility dome for the given bulk composition). Methods of preparing a phase separated composite glass based on a phase separated precursor glass or a template glass. Methods include combining a milled first glass corresponding to the first phase and a milled second glass corresponding to the second phase to form a glass mixture. Methods include melting the glass mixture at a temperature from about 25° C. to 0° C. less than an isotherm tie-line between endpoints of a pseudo-binary immiscibility dome defined by the phase separated precursor glass or the template glass.

Abstract: A system includes an overflow distributor and a support member. The overflow distributor includes a first sidewall, a second sidewall opposite the first sidewall, and a floor extending between the opposing first and second sidewalls. Interior surfaces of the first sidewall, the second sidewall, and the floor cooperatively define a trough configured to receive molten glass. Exterior surfaces of the first sidewall and the second sidewall are configured to direct molten glass that overflows the trough. The support member is disposed between the opposing first and second sidewalls of the overflow distributor and abutting an exterior surface of the floor of the overflow distributor.

Abstract: A carrier substrate includes a base layer having a first surface, and having a second surface that is parallel to and opposite of the first surface. The carrier substrate further includes a glass layer bonded to the first surface of the base layer. The carrier substrate has a Young's modulus greater than or equal to 150 GPa. A carrier substrate includes a polycrystalline ceramic and has a Young's modulus greater than or equal to 150 GPa. The carrier substrate has a coefficient of thermal expansion of greater than or equal to 20×10?7/° C. to less than or equal to 120×10?7/° C. over a range from 25° C. to 500° C.

Abstract: A housing for a portable electronic device includes a radio frequency transparent polycrystalline ceramic portion comprising a first surface and a second surface parallel to the first surface. The radio frequency transparent polycrystalline ceramic portion comprises a macro-texture on at least a portion of the first surface, and a predetermined micro-texture is disposed on at least a portion of the macro-texture. A method for manufacturing a housing for a portable electronic device includes forming a green ceramic article comprising a first surface and a second surface parallel to the first surface, embossing at least a portion of the first surface of the green ceramic article with a macro-texture, and sintering the green ceramic article comprising the macro-texture to form a sintered ceramic article. A predetermined micro-texture is disposed on at least a portion of the macro-texture.

Abstract: A housing for a portable electronic device includes a radio frequency transparent polycrystalline ceramic portion comprising a first surface and a second surface parallel to the first surface. The radio frequency transparent polycrystalline ceramic portion comprises a macro-texture on at least a portion of the first surface, and a predetermined micro-texture is disposed on at least a portion of the macro-texture. A method for manufacturing a housing for a portable electronic device includes forming a green ceramic article comprising a first surface and a second surface parallel to the first surface, embossing at least a portion of the first surface of the green ceramic article with a macro-texture, and sintering the green ceramic article comprising the macro-texture to form a sintered ceramic article. A predetermined micro-texture is disposed on at least a portion of the macro-texture.

Abstract: A system includes an overflow distributor and a support member. The overflow distributor includes a first sidewall, a second sidewall opposite the first sidewall, and a floor extending between the opposing first and second sidewalls. Interior surfaces of the first sidewall, the second sidewall, and the floor cooperatively define a trough configured to receive molten glass. Exterior surfaces of the first sidewall and the second sidewall are configured to direct molten glass that overflows the trough. The support member is disposed between the opposing first and second sidewalls of the overflow distributor and abutting an exterior surface of the floor of the overflow distributor.

Abstract: A carrier substrate includes a base layer having a first surface, and having a second surface that is parallel to and opposite of the first surface. The carrier substrate further includes a glass layer bonded to the first surface of the base layer. The carrier substrate has a Young's modulus greater than or equal to 150 GPa. A carrier substrate includes a polycrystalline ceramic and has a Young's modulus greater than or equal to 150 GPa. The carrier substrate has a coefficient of thermal expansion of greater than or equal to 20×10?7/° C. to less than or equal to 120×10?7/° C. over a range from 25° C. to 500° C.