Patents by Inventor Eric JAQUAY

Eric JAQUAY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of laser polishing a connectorized optical fiber and a connectorized optical fiber formed in accordance therewith
    Patent number: 9915791
    Abstract: Laser polishing is achieved by directing laser beam perpendicular at the fiber end face in a connectorized optical fiber having a metal ferrule. The spot size of the laser beam is larger than the bare optical fiber diameter, providing a more uniform spatial distribution of the radiation energy over the fiber end face. The metal ferrule provides heat conduction to prevent excessive heat built up at the fiber tip, which would lead to undesirable surface defects and geometries. The connectorized optical fiber may be pre-shaped prior to laser polishing. Subsequent laser polishing flattens the fiber end face.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: March 13, 2018
    Assignee: NANOPRECISION PRODUCTS, INC.
    Inventors: Ryan H. Woodward, Yang Chen, Robert Ryan Vallance, Eric Jaquay
  • METHOD OF LASER POLISHING A CONNECTORIZED OPTICAL FIBER AND A CONNECTORIZED OPTICAL FIBER FORMED IN ACCORDANCE THEREWITH
    Publication number: 20160187592
    Abstract: Laser polishing is achieved by directing laser beam perpendicular at the fiber end face in a connectorized optical fiber having a metal ferrule. The spot size of the laser beam is larger than the bare optical fiber diameter, providing a more uniform spatial distribution of the radiation energy over the fiber end face. The metal ferrule provides heat conduction to prevent excessive heat built up at the fiber tip, which would lead to undesirable surface defects and geometries. The connectorized optical fiber may be pre-shaped prior to laser polishing. Subsequent laser polishing flattens the fiber end face.
    Type: Application
    Filed: November 12, 2015
    Publication date: June 30, 2016
    Inventors: Ryan H. WOODWARD, Yang CHEN, Robert Ryan VALLANCE, Eric JAQUAY