Patents by Inventor Eric Jay Simmons

Eric Jay Simmons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240411085
    Abstract: Disclosed herein are approaches for adjusting local refractive index for photonics IC systems using selective waveguide ion implantation. In one approach, a method may include depositing an optical device film atop a base layer, patterning the optical device film into a plurality of sections, and implanting a first section of the plurality of sections of the optical device film to adjust a refractive index of the first section.
    Type: Application
    Filed: June 12, 2023
    Publication date: December 12, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Qintao ZHANG, Eric Jay SIMMONS, Mayrita ARRANDALE, Judeth Campbell SOUKUP, David J. LEE, Samphy HONG
  • Publication number: 20240255700
    Abstract: Disclosed herein are approaches for forming a uniform film with reduced surface roughness for photonic applications. One method includes providing a workpiece including a contact etch stop layer (CESL) over a device layer, patterning the CESL to expose an upper surface of the device layer in a waveguide target area, and patterning a waveguide from a dielectric film formed over the waveguide target area. The method may further include directing ions into an upper surface of the waveguide using a high-temperature ion implant to decrease a surface roughness of the upper surface of the waveguide.
    Type: Application
    Filed: January 30, 2023
    Publication date: August 1, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Eric Jay Simmons, Qintao Zhang, Wei Zou, Andrew Michael Waite, Jared Forrest Traynor, Miguel Sam Fung, Vincent V. Granuzzo, David J. Lee
  • Publication number: 20240145217
    Abstract: Methods for processing a dielectric film to improve its uniformity of thickness and refractive index are disclosed. The dielectric film is deposited using conventional approaches, such as chemical vapor deposition (CVD) or spin coating. The workpiece, with the applied dielectric film is then processed to improve the uniformity of the thickness. This processing may comprise implanting a thinning species to the thicker portions of the dielectric film to reduce the thickness of these portions. The thinning species may be silicon or another suitable species. This processing may alternatively or additionally include implanting a thickening species to the thinner portions of the dielectric film to increase their thickness. The thickening species may be helium or another suitable species. This approach may reduce the variation in thickness by 50% or more.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 2, 2024
    Inventors: Qintao Zhang, Eric Jay Simmons, JR., Jared Traynor, Wei Zou, Miguel Fung, Samphy Hong