Patents by Inventor Eric K. D. Chan

Eric K. D. Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7989712
    Abstract: The protective electronic prototyping enclosure is conveniently formed to accommodate various prototype electronic projects. Openings in the enclosure may be accurately formed and markings can be neatly and precisely formed by on a paper label printed by using the computer. Variable panels are provided for covering spaces between electrical components located adjacent to the side panels of the enclosure.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: August 2, 2011
    Inventor: Eric K. D. Chan
  • Publication number: 20100300747
    Abstract: The protective electronic prototyping enclosure is conveniently formed to accommodate various prototype electronic projects. Openings in the enclosure may be accurately formed and markings can be neatly and precisely formed by on a paper label printed by using the computer. Variable panels are provided for covering spaces between electrical components located adjacent to the side panels of the enclosure.
    Type: Application
    Filed: May 29, 2009
    Publication date: December 2, 2010
    Inventor: Eric K. D. Chan
  • Patent number: 7378600
    Abstract: A composite support for fabricating a prototype electrical circuit has a rectangular planar board with a plurality of rows and columns of double sided annular toroidal connection eyelets. The planar board is mounted on a rectangular support tray having a well. The connection eyelets of the planar board have a diameter of from 1.30 mm to 1.80 mm. A high temperature sheet material adhered to the entire undersurface of the planar board, which is pierced by leads of electrical components inserted into the connection eyelets. A spongy retainer block or a breadboard may also be located in the support tray well.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: May 27, 2008
    Inventors: Eric K. D. Chan, King Sum Chu
  • Patent number: 7068516
    Abstract: An enclosure for an electronic device has a front opening and rear opening formed by a base casing and a U-shaped cover mounted together thereon. A plurality of modular plates with electrical components pre-mounted thereon are removably and interchangeably mounted at selected positions in the front opening and rear opening of the base casing. The modular plates have an extension bottom leg portion having a shape and configuration with a complementary to those of mounting openings formed in even spacings along the entire length of the edge portion of the base casing. The modular plates also have an upper extension lip engageable with elongated channels formed on an underside edge portion of the front edge and rear edge of the cover.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: June 27, 2006
    Inventors: Eric K. D. Chan, King Sum Chu
  • Patent number: 6459587
    Abstract: A modular support and casing is provided with a selected circuit breadboard and circuit testing module for circuit construction and testing. Electrical and electronic components may be removably and interchangeably mounted on the circuit breadboard for constructing an electrical or electronic circuit in circuit development. A plurality of selective side plates are slidably and securely mounted on the longitudinal side edge portions of the support base. Auxiliary components such as switches and connectors may be conveniently provided in pre-formed openings on these side plates for ease in the circuit construction. A top cover is provided to maintain the side plates securely in place. The side plates form the side panels of the cover to provide a complete enclosure for protecting the electrical or electronic circuit thus constructed.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: October 1, 2002
    Inventor: Eric K. D. Chan