Abstract: A surface cleaning apparatus includes a battery powering one or more electric components. The surface cleaning apparatus can have a cleaning fluid delivery system and/or a cleaning fluid recovery system. The battery, or battery pack, is removable and has a sealing structure configured to resist ingress of cleaning fluid and other liquids.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly integrated secondary optics into LED chip cover structures for improved optical emission of high intensity LEDs is disclosed. Optical elements are integrated as a secondary optic onto one or both surfaces of a chip cover structure, where the chip cover structure may be referred to as a primary optic. The integrated secondary optic may be formed directly on one or both surfaces of the chip cover structure. The integrated secondary optic is purposely built to be coupled with the light emission of the LED to emit a desired emission profile. In this regard, a final luminaire may be provided with increased efficiency either by improving the coupling of the LED into a conventional secondary optic or in some cases by removing the need for a conventional secondary optic all together.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly cover structure arrangements for packaged LED devices are disclosed. Cover structures include light-absorbing layers configured to absorb certain wavelengths of light while permitting other wavelengths to pass therethrough. Light-absorbing layers may include pigment materials of colors that absorb intended wavelengths of light. In certain aspects, an LED package may include an LED chip configured to emit light of a first peak wavelength and a cover structure that includes a light-absorbing layer with a pigment of a color that absorbs the first peak wavelength. Such an arrangement may be useful for embodiments that also include a lumiphoric material that converts a portion of the first peak wavelength to light of a second peak wavelength.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly cover structure arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips and a cover structure that is arranged over the one or more LED chips that may provide protection from environmental exposure to underlying portions of the LED package. The cover structure may include arrangements of one or more layers or coatings that may be configured for providing improved emission characteristics for the LED package. The one or more layers or coatings may include antireflective structures, filter structures, and reflective structures individually or in various combinations with one another to provide one or more of improved light output, increased light extraction, improved emission uniformity, and improved emission contrast for the LED package.