Patents by Inventor Eric Kirchner

Eric Kirchner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8979106
    Abstract: A tire protection mount may include a bracket that includes a central platform and an arm. The central platform is connected the arm to define an opening. The tire protection mount further includes a shield connected to the bracket that substantially covers the opening.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: March 17, 2015
    Assignee: Shoup Manufacturing Company
    Inventors: Merle Benoit, Eric Kirchner
  • Publication number: 20140131973
    Abstract: A tire protection mount may include a bracket that includes a central platform and an arm. The central platform is connected the arm to define an opening. The tire protection mount further includes a shield connected to the bracket that substantially covers the opening.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 15, 2014
    Inventors: Merle Benoit, Eric Kirchner
  • Publication number: 20070250273
    Abstract: Method for matching of a repair paint to texture properties and optionally colour of a paint film on a substrate to be repaired characterized in that a database is used of paint modules with specified texture data, which are used to calculate expected texture of a combination of modules on basis of concentrations of the paint modules.
    Type: Application
    Filed: September 16, 2005
    Publication date: October 25, 2007
    Applicant: Akzo Nobel Coatings International B.V.
    Inventors: Klaas De Haas, Swie Njo, Eric Kirchner, Roelof Gottenbos
  • Publication number: 20050181615
    Abstract: A method for monitoring polishing process parameters for an integrated circuit structure on a substrate. A first metrology site is constructed on the substrate. The first metrology site represents a design extreme of a high density integrated circuit structure. The first metrology site is formed by placing a relatively small horizontal surface area trench within a relatively large surface area field of a polish stop material. A second metrology site is also constructed on the substrate. The second metrology site represents a design extreme of a low density integrated circuit structure. The second metrology site is formed by placing a relatively large horizontal surface area trench within a relatively small surface area field of a polish stop material. The substrate is covered with a layer of an insulating material, thereby at least filling the trenches.
    Type: Application
    Filed: March 4, 2005
    Publication date: August 18, 2005
    Inventors: Peter Burke, Eric Kirchner, James Elmer
  • Patent number: D742938
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: November 10, 2015
    Assignee: Shoup Manufacturing Co., Inc.
    Inventors: Merle Benoit, Eric Kirchner