Patents by Inventor Eric L. Brown
Eric L. Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240141649Abstract: A method is disclosed for producing photocatalytic coated ceramic granules. The method involves providing a coatable composition containing an inorganic binder and a variety of photocatalytic particles, such as TiO2, ZnO, Ti(OH)4, doped derivatives, or combinations thereof. These photocatalytic particles have a surface area per weight of no more than 15 m2/g. The coatable composition is then applied to uncoated base ceramic granules, resulting in intermediate coated granules. Finally, the intermediate coated granules are heated at a temperature of at least 700° C., leading to the formation of photocatalytic coated ceramic granules. These granules exhibit a Total Solar Reflectance (TSR) value of at least 0.7. This method offers an efficient and effective way to produce ceramic granules with enhanced photocatalytic properties.Type: ApplicationFiled: January 9, 2024Publication date: May 2, 2024Inventors: Taisiya Skorina, Rebecca L. A. Everman, Jean A. Tangeman, Eric J. VanBruggen, Kenton D. Budd, Rachael A. T. Gould, Robert P. Brown, Lara K. N. Ughetta, Jonathan A. Hubin, Zachary M. Schaeffer
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Publication number: 20230402161Abstract: A system for secure lockers for dispensing medical devices includes a plurality of lockers, each of the plurality of lockers having a respective door; an I/O device; and a controller in communication with each of the plurality of lockers and to the I/O device. The controller is configured to receive a code; process the code to retrieve a datapoint indicative of an order; command the I/O device to display a prompt for additional verifying information regarding the order; in response to receiving additional verifying information, determine a locker of the plurality of lockers associated with the order; and command the respective door of the determined locker to open.Type: ApplicationFiled: June 14, 2023Publication date: December 14, 2023Inventor: Eric L. Brown
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Patent number: 11264938Abstract: A thermophotovoltaic panel assembly including a heat sink and a plurality of thermophotovoltaic modules mounted on the heat sink. Each thermophotovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The thermophotovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the thermophotovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.Type: GrantFiled: February 8, 2017Date of Patent: March 1, 2022Assignee: MTPV POWER CORPORATIONInventors: Brian N. Hubert, Bin Zhang, Eric L. Brown, Timothy R. Schuyler, David Mather, Paul Greiff, Christopher W. Melanson, Bruno A. Nardelli, Shannon J. Kovar, Trace W. Cody
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Publication number: 20210259728Abstract: A trocar is provided for providing access to body cavities during minimally invasive surgeries. The trocar possesses an elongate body formed of an outer tube and an inner tube, both of which are threaded. Rotating the outer tube about the inner tube permits adjustment of the length of the elongate body of the trocar. A locking collar on the trocar is used to maintain the elongate body at the desired length.Type: ApplicationFiled: February 25, 2020Publication date: August 26, 2021Inventors: Justin J. Thomas, Jacob C. Baril, Matthew A. Dinino, Roy J. Pilletere, Eric L. Brown, Nicolette R. LaPierre, Gregory R. Morck
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Publication number: 20210228233Abstract: Access assemblies include an instrument valve housing and a valve assembly disposed within the cavity of the instrument valve housing. The valve assembly includes a guard assembly, and a seal assembly disposed distal of the guard assembly. The seal assembly includes a support member including a ring portion and a seal portion disposed within the ring portion. The seal assembly further includes a plurality of seal sections extending from the ring portion of the support member. The support member and the plurality of seal sections are integrally formed.Type: ApplicationFiled: January 28, 2020Publication date: July 29, 2021Inventors: Roy J. Pilletere, Jason T. Mickus, Nicolette R. LAPIERRE, Matthew A. Dinino, Eric L. Brown
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Publication number: 20190144528Abstract: Disclosed are antibodies (immunoglobulins) and fragments thereof that hydrolyze or bind polypeptide antigens belonging to Staphylococcus aureus, hepatitis C virus, human immunodeficiency virus and Alzheimer's disease. Also disclosed are novel methods to improve the antigen reactivity of the immunoglobulins and to treat a pathophysiological condition using the immunoglobulins as therapeutics.Type: ApplicationFiled: May 14, 2018Publication date: May 16, 2019Inventors: Sudhir Paul, Stephanie Planque, Yasuhiro Nishiyama, Eric L. Brown, Keri C. Smith, Hiroaki Taguchi
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Patent number: 9969797Abstract: Disclosed are antibodies (immunoglobulins) and fragments thereof that hydrolyze or bind polypeptide antigens belonging to Staphyloccus aureus, hepatitis C virus, human immunodeficiency virus and Alzheimer's disease. Also disclosed are novel methods to improve the antigen reactivity of the immunoglobulins and to treat a pathophysiological condition using the immunoglobulins as therapeutics.Type: GrantFiled: October 23, 2009Date of Patent: May 15, 2018Assignee: Covalent Bioscience IncorporatedInventors: Sudhir Paul, Stephanie Planque, Yasuhiro Nishiyama, Eric L. Brown, Keri C. Smith, Hiroaki Taguchi
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Publication number: 20170229996Abstract: A photovoltaic panel assembly including a heat sink and a plurality of photovoltaic modules mounted on the heat sink. Each photovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The photovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the photovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.Type: ApplicationFiled: February 8, 2017Publication date: August 10, 2017Inventors: Brian N. Hubert, Bin Zhang, Eric L. Brown, Timothy R. Schuyler, DAvid Mather, Paul Greiff, Christopher W. Melanson, Bruno A. Nardelli, Shannon J. Kovar, Trace W. Cody
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Patent number: 8791357Abstract: The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic cells are pushed outward against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.Type: GrantFiled: February 28, 2011Date of Patent: July 29, 2014Assignee: MTPV Power CorporationInventors: Eric L. Brown, Robert S. DiMatteo, Bruno A. Nardelli, Bin Peng, Xiao Li
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Publication number: 20110315195Abstract: The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic cells are pushed outward against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.Type: ApplicationFiled: February 28, 2011Publication date: December 29, 2011Applicant: MTPV CorporationInventors: Eric L. Brown, Robert S. DiMatteo, Bruno A. Nardelli, Bin Peng, Xiao Li
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Publication number: 20100183614Abstract: Disclosed are antibodies (immunoglobulins) and fragments thereof that hydrolyze or bind polypeptide antigens belonging to Staphyloccus aureus, hepatitis C virus, human immunodeficiency virus and Alzheimer's disease. Also disclosed are novel methods to improve the antigen reactivity of the immunoglobulins and to treat a pathophysiological condition using the immunoglobulins as therapeutics.Type: ApplicationFiled: October 23, 2009Publication date: July 22, 2010Inventors: Sudhir Paul, Stephanie Planque, Yasuhiro Nishiyama, Eric L. Brown, Keri C. Smith, Hiroaki Taguchi
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Publication number: 20040071703Abstract: Borrelia burgdorferi, the causative agent of Lyme disease (LD), expresses two decorin-binding adhesins (DbpA and DbpB) and at least one fibronectin-binding adhesin (BBK32). Mice deficient in decorin have been shown to have an increased resistance to Borrelia infection in both tick- and needle-inoculation models compared to control mice. BBK32 was used to vaccinate both decorin-deficient and wild-type mice prior to B. burdorferi infection. Decorin-deficient, BBK32-immunized mice had fewer positive ear, bladder and joint cultures compared to genotype and wild-type controls. These data suggest that a vaccine composed of BBK32/DbpA or components thereof may emerge as an effective vaccine treatment against LD.Type: ApplicationFiled: October 9, 2003Publication date: April 15, 2004Inventors: Eric L. Brown, Magnus Hook, William S. Probert, Jung-Hwa Kim
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Patent number: 6517838Abstract: Borrelia burgdorferi, the causative agent of Lyme disease, expresses on its surface a decorin binding protein, DbpA and DbpB. Lysine residues necessary for DbpA binding to decorin and DbpA peptides containing these critical residues essential for decorin binding are disclosed. It is further disclosed that vaccination using peptides incorporating these critical binding domains of DbpA can confer a delayed-type hypersensitivity response to DbpA and reduce the number of B. burgdorferi organisms present in infected animals.Type: GrantFiled: June 16, 2000Date of Patent: February 11, 2003Assignee: The Texas A&M University SystemInventors: Magnus A. H{umlaut over (oo)}k, Eric L. Brown