Patents by Inventor Eric L. Fleischmann

Eric L. Fleischmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Overmolded circuit board and method
    Patent number: 8230575
    Abstract: An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or “shot”.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: July 31, 2012
    Assignee: Innotec Corporation
    Inventors: Thomas J. Veenstra, Jason R. Mulder, Eric L. Fleischmann
  • Light for vehicles
    Patent number: 7712933
    Abstract: A light for motor vehicles and the like includes one or more LEDs that are embedded in a polymer material. The light may be positioned on an exposed surface of the vehicle, and the encapsulation of the LEDs and other electrical components provides a waterproof assembly that is substantially impervious to ambient conditions. The light may include a light source and a light guide that are disposed in a watertight housing.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: May 11, 2010
    Assignee: InterLum, LLC
    Inventors: Eric L. Fleischmann, Nick J. DeVries, Thomas J. Veenstra, Michael K. Judge
  • OVERMOLDED CIRCUIT BOARD AND METHOD
    Publication number: 20090154182
    Abstract: An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or “shot”.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 18, 2009
    Inventors: Thomas J. Veenstra, Jason R. Mulder, Eric L. Fleischmann
  • LIGHT FOR VEHICLES
    Publication number: 20080253140
    Abstract: A light for motor vehicles and the like includes one or more LEDs that are embedded in a polymer material. The light may be positioned on an exposed surface of the vehicle, and the encapsulation of the LEDs and other electrical components provides a waterproof assembly that is substantially impervious to ambient conditions. The light may include a light source and a light guide that are disposed in a watertight housing.
    Type: Application
    Filed: March 19, 2008
    Publication date: October 16, 2008
    Inventors: Eric L. Fleischmann, Nick J. DeVries, Thomas J. Veenstra, Michael K. Judge