Patents by Inventor Eric Leo

Eric Leo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11156607
    Abstract: The present invention relates to systems and methods that utilize a combination of immunoassay and magnetic immunoassay techniques to detect an analyte within an extended range of specified concentrations. In particular, a device includes a housing, a heterogeneous surface capture immunosensor within the housing and configured to generate a first signal indicative of the concentration of the analyte in an upper concentration range, and a homogeneous magnetic bead capture immunosensor within the housing and configured to generate a second signal indicative of the concentration of the analyte in a lower concentration range.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: October 26, 2021
    Assignee: Abbott Point of Care Inc.
    Inventors: Jing Hua Hu, Antti Leo Oskari Virtanen, John Wilfrid Bezaire, Eric Edward Potter, James T. K. Smith, Cary James Miller, John Lewis Emerson Campbell, Adam Roger Moss
  • Publication number: 20210257788
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20210234290
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 29, 2021
    Applicant: Amphenol Corporation
    Inventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20210184404
    Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.
    Type: Application
    Filed: February 22, 2021
    Publication date: June 17, 2021
    Applicant: Amphenol Corporation
    Inventors: Thomas S. Cohen, Robert Richard, Eric Leo
  • Publication number: 20210091496
    Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Donald A. Girard, JR., Eric Leo
  • Patent number: 10931062
    Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: February 23, 2021
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Robert Richard, Eric Leo
  • Publication number: 20200266585
    Abstract: An interconnection system with lossy material of a first connector adjacent a ground conductor of a second connector. The lossy material may damp resonances at a mating interface of the first and second connectors. In some embodiments, the lossy material may be attached to a ground conductor of the first connector. In some embodiments, the lossy material may be shaped as horns that extend along a cavity configured to receive a ground conductor of a mating connector.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 20, 2020
    Applicant: Amphenol Corporation
    Inventors: Jose Ricardo Paniagua, Philip T. Stokoe, Thomas S. Cohen, Bob Richard, Donald W. Milbrand, Eric Leo, Mark W. Gailus
  • Publication number: 20200205978
    Abstract: The disclosure relates to a device that is configured to be implanted on the native leaflet of a heart valve to increase its length and/or thickness and thereby to improve the valve function and reduce regurgitation. The device may include a leaflet section. The leaflet section may include a central member. The central member may include a first portion, a second portion that opposes the first portion, and a base portion disposed between the first portion and the second portion. The first section may extend from the first portion and the second section may extend from the second portion. The device may include one or more engaging members extending from the central member at an angle with respect to the first section and the second section. The second section may be larger than the first section. The leaflet section may define a three-dimensional region or a bulge.
    Type: Application
    Filed: July 23, 2018
    Publication date: July 2, 2020
    Inventors: Sai Muralidhar Padala, Eric Leo Sarin
  • Publication number: 20200194940
    Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.
    Type: Application
    Filed: November 20, 2019
    Publication date: June 18, 2020
    Applicant: Amphenol Corporation
    Inventors: Thomas S. Cohen, Bob Richard, Eric Leo