Patents by Inventor Eric Leo
Eric Leo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420874Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.Type: ApplicationFiled: April 24, 2023Publication date: December 28, 2023Applicant: Amphenol CorporationInventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
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Publication number: 20230352866Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.Type: ApplicationFiled: July 6, 2023Publication date: November 2, 2023Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., Donald A. Girard, JR., Eric Leo
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Patent number: 11742620Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.Type: GrantFiled: February 22, 2021Date of Patent: August 29, 2023Assignee: Amphenol CorporationInventors: Thomas S. Cohen, Robert Richard, Eric Leo
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Patent number: 11735852Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.Type: GrantFiled: September 17, 2020Date of Patent: August 22, 2023Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., Donald A. Girard, Jr., Eric Leo
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Publication number: 20230238745Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.Type: ApplicationFiled: January 23, 2023Publication date: July 27, 2023Applicant: Amphenol CorporationInventors: Thomas S. Cohen, Robert Richard, Eric Leo
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Publication number: 20230138388Abstract: The disclosure relates to a device that is configured to be implanted on the native leaflet of a heart valve to increase its length and/or thickness and thereby to improve the valve function and reduce regurgitation. The device may include a leaflet section. The leaflet section may include a central member. The central member may include a first portion, a second portion that opposes the first portion, and a base portion disposed between the first portion and the second portion. The first section may extend from the first portion and the second section may extend from the second portion. The device may include one or more engaging members extending from the central member at an angle with respect to the first section and the second section. The second section may be larger than the first section. The leaflet section may define a three-dimensional region or a bulge.Type: ApplicationFiled: December 27, 2022Publication date: May 4, 2023Inventors: Sai Muralidhar Padala, Eric Leo Sarin
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Patent number: 11637403Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.Type: GrantFiled: January 27, 2021Date of Patent: April 25, 2023Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
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Patent number: 11637389Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.Type: GrantFiled: January 27, 2021Date of Patent: April 25, 2023Assignee: Amphenol CorporationInventors: John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
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Patent number: 11571305Abstract: The disclosure relates to a device that is configured to be implanted on the native leaflet of a heart valve to increase its length and/or thickness and thereby to improve the valve function and reduce regurgitation. The device may include a leaflet section. The leaflet section may include a central member. The central member may include a first portion, a second portion that opposes the first portion, and a base portion disposed between the first portion and the second portion. The first section may extend from the first portion and the second section may extend from the second portion. The device may include one or more engaging members extending from the central member at an angle with respect to the first section and the second section. The second section may be larger than the first section. The leaflet section may define a three-dimensional region or a bulge.Type: GrantFiled: July 23, 2018Date of Patent: February 7, 2023Assignee: Emory UniversityInventors: Sai Muralidhar Padala, Eric Leo Sarin
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Patent number: 11563292Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.Type: GrantFiled: February 22, 2021Date of Patent: January 24, 2023Assignee: Amphenol CorporationInventors: Thomas S. Cohen, Robert Richard, Eric Leo
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Publication number: 20210257788Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.Type: ApplicationFiled: January 27, 2021Publication date: August 19, 2021Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
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Publication number: 20210234290Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.Type: ApplicationFiled: January 27, 2021Publication date: July 29, 2021Applicant: Amphenol CorporationInventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
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Publication number: 20210184404Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.Type: ApplicationFiled: February 22, 2021Publication date: June 17, 2021Applicant: Amphenol CorporationInventors: Thomas S. Cohen, Robert Richard, Eric Leo
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Publication number: 20210091496Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.Type: ApplicationFiled: September 17, 2020Publication date: March 25, 2021Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., Donald A. Girard, JR., Eric Leo
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Patent number: 10931062Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.Type: GrantFiled: November 20, 2019Date of Patent: February 23, 2021Assignee: Amphenol CorporationInventors: Thomas S. Cohen, Robert Richard, Eric Leo
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Publication number: 20200266585Abstract: An interconnection system with lossy material of a first connector adjacent a ground conductor of a second connector. The lossy material may damp resonances at a mating interface of the first and second connectors. In some embodiments, the lossy material may be attached to a ground conductor of the first connector. In some embodiments, the lossy material may be shaped as horns that extend along a cavity configured to receive a ground conductor of a mating connector.Type: ApplicationFiled: February 19, 2020Publication date: August 20, 2020Applicant: Amphenol CorporationInventors: Jose Ricardo Paniagua, Philip T. Stokoe, Thomas S. Cohen, Bob Richard, Donald W. Milbrand, Eric Leo, Mark W. Gailus
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Publication number: 20200205978Abstract: The disclosure relates to a device that is configured to be implanted on the native leaflet of a heart valve to increase its length and/or thickness and thereby to improve the valve function and reduce regurgitation. The device may include a leaflet section. The leaflet section may include a central member. The central member may include a first portion, a second portion that opposes the first portion, and a base portion disposed between the first portion and the second portion. The first section may extend from the first portion and the second section may extend from the second portion. The device may include one or more engaging members extending from the central member at an angle with respect to the first section and the second section. The second section may be larger than the first section. The leaflet section may define a three-dimensional region or a bulge.Type: ApplicationFiled: July 23, 2018Publication date: July 2, 2020Inventors: Sai Muralidhar Padala, Eric Leo Sarin
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Publication number: 20200194940Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.Type: ApplicationFiled: November 20, 2019Publication date: June 18, 2020Applicant: Amphenol CorporationInventors: Thomas S. Cohen, Bob Richard, Eric Leo