Abstract: Embodiments of techniques and systems for managing performance of a computing system are described. In embodiments, parameters may be received describing control variables for a computing system, workloads that are performed on the computing system, and performance metrics for the computing system. An experimental plan may be generated for modifying the control variables during execution of the computing system and observing performance metrics during this execution. The recorded observations may then be used in to determine one or more relationships between the control variables and the performance metrics. Relationships between the control variables and a desirability function associated with performance of the computer system may also be determined. These relationships may be displayed in visualizations to a user, and may be used to by the user to select values for the computing system which increase the desirability function. Other embodiments may be described and claimed.

Abstract: Embodiments of techniques and systems for managing performance of a computing system are described. In embodiments, parameters may be received describing control variables for a computing system, workloads that are performed on the computing system, and performance metrics for the computing system. An experimental plan may be generated for modifying the control variables during execution of the computing system and observing performance metrics during this execution. The recorded observations may then be used in to determine one or more relationships between the control variables and the performance metrics. Relationships between the control variables and a desirability function associated with performance of the computer system may also be determined. These relationships may be displayed in visualizations to a user, and may be used to by the user to select values for the computing system which increase the desirability function. Other embodiments may be described and claimed.

Abstract: A method for relating expected frequencies and magnitudes of temperature fluctuations encountered by the package/chip device over a product lifetime to parameters of an accelerated life test used to assess reliability is provided. A particular market application use for the package/chip device is specified, and expected frequencies and magnitudes of temperature fluctuations of the package/chip device in each of a plurality of temperature fluctuation regimes are quantified. The expected frequencies and magnitudes of fluctuations in each of the regimes are dependent on the particular market application use of the package/chip device. The quantified expected frequencies and magnitudes of the temperature fluctuations of the package/chip device in each of the temperature regimes are incorporated into an accelerated life model in which parameters of the accelerated life test are related to the frequencies and magnitudes of the temperature fluctuations in each of the temperature fluctuation regimes.