Abstract: A system for batch forming a sheet of spring elements in three dimensions includes a top spacer layer. A plurality of ball bearings is arranged in a predetermined pattern on the top spacer layer. A spring element sheet containing the spring elements defined in two dimensions is positioned on the top spacer layer and the plurality of ball bearings. A top spacer layer is positioned on the spring element sheet. The top spacer layer and the bottom support layer are adapted to have a force applied thereto to push the plurality of ball bearings against the spring element sheet, such that the spring elements extend above the plane of the spring element sheet, thereby forming the spring elements in three dimensions.

Abstract: A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.