Patents by Inventor Eric M. Rieder
Eric M. Rieder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12390835Abstract: There are provided an ultrasonic transducer and methods for designing and manufacturing the same. The ultrasonic transducer includes a piezoelectric composite layer configured to be in acoustic communication with a sample and having at least partially decoupled acoustic impedance and electrical impedance properties. The piezoelectric composite layer includes an array of spaced-apart piezoelectric regions, each being made from a piezoelectric material, a filler material positioned between adjacent spaced-apart piezoelectric regions, the filler material comprising a polymer matrix and a non-piezoelectric material in contact with the polymer matrix.Type: GrantFiled: June 2, 2023Date of Patent: August 19, 2025Assignee: RESONANT ACOUSTICS INTERNATIONAL INC.Inventors: Nicholas Chris Chaggares, Eric M. Rieder, Khachic Karshafian
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Publication number: 20230302496Abstract: There are provided an ultrasonic transducer and methods for designing and manufacturing the same. The ultrasonic transducer includes a piezoelectric composite layer configured to be in acoustic communication with a sample and having at least partially decoupled acoustic impedance and electrical impedance properties. The piezoelectric composite layer includes an array of spaced-apart piezoelectric regions, each being made from a piezoelectric material, a filler material positioned between adjacent spaced-apart piezoelectric regions, the filler material comprising a polymer matrix and a non-piezoelectric material in contact with the polymer matrix.Type: ApplicationFiled: June 2, 2023Publication date: September 28, 2023Applicant: RESONANT ACOUSTICS INTERNATIONAL INC.Inventors: Nicholas Chris Chaggares, Eric M. Rieder, Khachic Karshafian
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Patent number: 11701689Abstract: There are provided an ultrasonic transducer and methods for designing and manufacturing the same. The ultrasonic transducer includes a piezoelectric composite layer configured to be in acoustic communication with a sample and having at least partially decoupled acoustic impedance and electrical impedance properties. The piezoelectric composite layer includes an array of spaced-apart piezoelectric regions, each being made from a piezoelectric material, a filler material positioned between adjacent spaced-apart piezoelectric regions, the filler material comprising a polymer matrix and a non-piezoelectric material in contact with the polymer matrix.Type: GrantFiled: July 31, 2019Date of Patent: July 18, 2023Assignee: RESONANT ACOUSTICS INTERNATIONAL INC.Inventors: Nicholas Chris Chaggares, Eric M. Rieder, Khachic Karshafian
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Publication number: 20200038912Abstract: There are provided an ultrasonic transducer and methods for designing and manufacturing the same. The ultrasonic transducer includes a piezoelectric composite layer configured to be in acoustic communication with a sample and having at least partially decoupled acoustic impedance and electrical impedance properties. The piezoelectric composite layer includes an array of spaced-apart piezoelectric regions, each being made from a piezoelectric material, a filler material positioned between adjacent spaced-apart piezoelectric regions, the filler material comprising a polymer matrix and a non-piezoelectric material in contact with the polymer matrix.Type: ApplicationFiled: July 31, 2019Publication date: February 6, 2020Applicant: Resonant Acoustics International Inc.Inventors: Nicholas Chris Chaggares, Eric M. Rieder, Khachic Karshafian
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Patent number: 6869404Abstract: A minimally invasive, implantable heart sound and ECG monitor and associated method for deriving blood pressure from heart sound data. The device is equipped with an acoustical sensor for detecting first and second heart sounds which are sampled and stored during sensing windows following R-wave and T-wave detections, respectively. ECG and heart sound data are stored in a continuous, looping memory, and segments of data are stored in long-term memory upon an automatic or manual data storage triggering event. Estimated blood pressure is calculated based on custom spectral analysis and processing of the first and second heart sounds. A calibration method includes measuring a patient's blood pressure using a standard clinical method and performing regression analysis on multiple spectral variables to identify a set of best fit weighted equations for predicting blood pressure. Concurrent ECG and estimated blood pressure may be displayed for review by a physician.Type: GrantFiled: February 26, 2003Date of Patent: March 22, 2005Assignee: Medtronic, Inc.Inventors: Randal C. Schulhauser, Gary Stefanov, Jon S. Tracy, Eric M. Rieder, Mark Son, Brian B. Lee, Nicole M. Haupt
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Publication number: 20040167417Abstract: A minimally invasive, implantable heart sound and ECG monitor and associated method for deriving blood pressure from heart sound data. The device is equipped with an acoustical sensor for detecting first and second heart sounds which are sampled and stored during sensing windows following R-wave and T-wave detections, respectively. ECG and heart sound data are stored in a continuous, looping memory, and segments of data are stored in long-term memory upon an automatic or manual data storage triggering event. Estimated blood pressure is calculated based on custom spectral analysis and processing of the first and second heart sounds. A calibration method includes measuring a patient's blood pressure using a standard clinical method and performing regression analysis on multiple spectral variables to identify a set of best fit weighted equations for predicting blood pressure. Concurrent ECG and estimated blood pressure may be displayed for review by a physician.Type: ApplicationFiled: February 26, 2003Publication date: August 26, 2004Inventors: Randal C. Schulhauser, Gary Stefanov, Jon S. Tracy, Eric M. Rieder, Mark Son, Brian B. Lee, Nicole M. Haupt
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Patent number: 5851221Abstract: An implantable medical device of the type formed of a hermetically sealed enclosure attached on a enclosure attachment surface thereof to a module attachment surface of a pre-formed header module is disclosed. The pre-formed header module is attached to the enclosure attachment surface through use of a retention structure extending away from the enclosure surface into proximity with a portion of the pre-formed header module when the enclosure and module attachment surfaces are aligned with respect to one another. The retention structure comprises a bendable member that is bent from an initial position allowing the pre-formed header module to be seated with respect to the hermetically sealed enclosure to a retention position making an attachment against a bend engaging portion of the pre-formed header module.Type: GrantFiled: August 1, 1997Date of Patent: December 22, 1998Assignee: Medtronic Inc.Inventors: Eric M. Rieder, Frank Gonzalez, Randal C. Schulhauser, Bryan Zart
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Patent number: 5431695Abstract: An implantable medical device including a hermetic housing containing an electronic circuit, such as a cardiac pacemaker. The electronic circuit may be coupled to a medical lead by means of a connector module which is formed as part of a molded, resilient shroud, extending around the circumference of the hermetic container.Type: GrantFiled: November 23, 1993Date of Patent: July 11, 1995Assignee: Medtronic, Inc.Inventors: Craig L. Wiklund, Daniel A. Lyons, Eric M. Rieder, John E. Nicholson, Randy C. Schulhauser