Patents by Inventor Eric M. Schultz

Eric M. Schultz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conditioning Tools and Techniques for Chemical Mechanical Planarization
    Publication number: 20120060426
    Abstract: Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.
    Type: Application
    Filed: November 21, 2011
    Publication date: March 15, 2012
    Applicants: SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC.
    Inventors: Thomas PUTHANANGADY, Taewook Hwang, Srinivasan Ramanath, Eric M. Schultz, J. Gary Baldoni, Biljana Buljan, Charles Dinh-Ngoc
  • CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION
    Publication number: 20080271384
    Abstract: Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.
    Type: Application
    Filed: September 19, 2007
    Publication date: November 6, 2008
    Applicant: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: Thomas Puthanangady, Taewook Hwang, Srinivasan Ramanath, Eric M. Schultz, J. Gary Baldoni, Sergej-Tomislav Buljan, Charles Dinh-Ngoc