Patents by Inventor Eric Mahendra Kumar

Eric Mahendra Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid-assisted bottom air cooling of electronic racks in data centers
    Patent number: 9635785
    Abstract: A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: April 25, 2017
    Assignee: BAIDU USA LLC
    Inventors: Ali Heydari, Eric Mahendra Kumar, Charles J. Ingalz, Weiyu Lu, Tianyi Gao, Manasa Sahini, Yan Cui
  • LIQUID-ASSISTED BOTTOM AIR COOLING OF ELECTRONIC RACKS IN DATA CENTERS
    Publication number: 20170105317
    Abstract: A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.
    Type: Application
    Filed: November 9, 2015
    Publication date: April 13, 2017
    Inventors: Ali Heydari, Eric Mahendra Kumar, Charles J. Ingalz, Weiyu Lu, Tianyi Gao, Manasa Sahini, Yan Cui