Patents by Inventor Eric Matthew JOHNSON

Eric Matthew JOHNSON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RF amplifiers with series-coupled output bondwire arrays and shunt capacitor bondwire array
    Patent number: 11476209
    Abstract: Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: October 18, 2022
    Assignee: NXP B.V.
    Inventors: Vikas Shilimkar, Kevin Kim, Richard Emil Sweeney, Eric Matthew Johnson
  • RF AMPLIFIERS WITH SERIES-COUPLED OUTPUT BONDWIRE ARRAYS AND SHUNT CAPACITOR BONDWIRE ARRAY
    Publication number: 20210225784
    Abstract: Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 22, 2021
    Inventors: Vikas SHILIMKAR, Kevin KIM, Richard Emil SWEENEY, Eric Matthew JOHNSON