Patents by Inventor Eric Matthew Vine

Eric Matthew Vine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensor device with a MEMS piezoresistive element attached to an in-circuit ceramic board
    Patent number: 10119875
    Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: November 6, 2018
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Jen-Huang Albert Chiou, Benjamin C. Lin, Eric Matthew Vine
  • PRESSURE SENSOR DEVICE WITH A MEMS PIEZORESISTIVE ELEMENT ATTACHED TO AN IN-CIRCUIT CERAMIC BOARD
    Publication number: 20160377496
    Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 29, 2016
    Inventors: Jen-Huang Albert Chiou, Benjamin C. Lin, Eric Matthew Vine