Abstract: Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.

Abstract: Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.

Abstract: In one embodiment, an interface may include various mechanisms to handle incoming clock and data signals. More specifically, the interface includes a first multiplexer to receive a first data signal via a serial peripheral interface (SPI) bus coupled to a first pin and a second multiplexer to receive a first clock signal via the SPI bus coupled to a second pin of the first IC and a second clock signal via an inter-integrated circuit (I2C) bus coupled to a third pin. In addition, the interface may include a decoder to receive the second clock signal and a second data signal via the I2C bus coupled to a fourth pin.

Abstract: In one embodiment, an interface may include various mechanisms to handle incoming clock and data signals. More specifically, the interface includes a first multiplexer to receive a first data signal via a serial peripheral interface (SPI) bus coupled to a first pin and a second multiplexer to receive a first clock signal via the SPI bus coupled to a second pin of the first IC and a second clock signal via an inter-integrated circuit (I2C) bus coupled to a third pin. In addition, the interface may include a decoder to receive the second clock signal and a second data signal via the I2C bus coupled to a fourth pin.