Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An immersion cooling chassis includes a first face, a second face opposite the first face, a third face disposed between the first face and the second face, the third face perpendicular to the first face, a fourth face disposed between the first face and the second face, the fourth face perpendicular to the first face and opposite the third face, and a first portion to be cooled via a first convection of a coolant fluid, the first portion including a coolant inlet defined in the third face, and a coolant outlet defined in the first face, and a second portion to be cooled via a second convection of air, the second portion including an air inlet defined in the first face between the fourth face and the coolant outlet.

Abstract: A method and apparatus for holding a screw captive to a printed circuit board (PCB), with a channel formed through the apparatus and a mounting hole formed through the PCB being in alignment to allow a screw to pass therethrough.

Abstract: A method and an apparatus for releasably retaining a heatsink in contact with an IC attached to a circuitboard in which the heatsink is inserted into a spring cage that is pivotally connected with an actuation lever, wherein at least a pair of spring tabs engage the heatsink to press a thermal conductive surface of the heatsink towards a circuitboard and an IC attached to the circuitboard when the combination of the heatsink, actuation lever and spring cage are inserted into the rectangular frame of a retention module mounted on the circuitboard so as to surround the IC and the lever portion of the actuation lever is pivoted towards the spring cage so as to cause retention points on the actuator portions of the actuation lever and on the rectangular frame of the spring cage to engage corresponding retention points on the rectangular frame of the retention module.