Patents by Inventor Eric Michael Radza

Eric Michael Radza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spring connector for making electrical contact at semiconductor scales
    Patent number: 7989945
    Abstract: A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: August 2, 2011
    Assignee: Neoconix, Inc.
    Inventors: John David Williams, Eric Michael Radza