Abstract: An information handling system, including a chassis, including: a computing component; a cooling system to provide temperature management of at least the computing component, the cooling system including: a plurality of fluid lines for transporting liquid proximate to the computing component, the liquid configured to provide cooling of the computing component; a coupling connector between a first fluid line and a second fluid line of the plurality of fluid lines; and an absorbent material positioned on a surface of the chassis proximate to the coupling connector such that the absorbent material is configured to absorb fluid that leaks from the coupling connector.

Abstract: A rack assembly for physically supporting information technology (IT) devices is disclosed. The rack assembly includes a plurality of interconnected panels forming a volumetric space having a front access and a rear access with opposing side panels. The front access and the rear access extend from a bottom edge to a top edge. The plurality of interconnected panels allow air to flow in either direction between the front access and the rear access. An ambient temperature indicator is mounted adjacent to the front access or the rear access. The ambient temperature indicator is configured to visually indicate temperature values between the top edge and the bottom edge.

Abstract: Systems are provided for liquid cooling of an IHS (Information Handling System) installed in a computing rack that includes a liquid cooling manifold. A liquid cooling coupling connects the IHS to the liquid cooling manifold. A busbar of the rack is coupled to the IHS and provides power to the IHS. A leak detection bar is attached to the busbar and includes leak detection sensors that are directed at the liquid cooling coupling connecting the IHS to the liquid cooling manifold.

Abstract: A smart liquid coolant monitor associated with a plurality of liquid cooled information handling systems includes a temperature sensor, a pressure sensor, a flow meter for detecting coolant temperature, pressure, and flow rate respectively, and a computer-based controller configured to convert signals representing temperature, pressure, and flow rate from the sensors to data signals and transmit the data signals to a data center building management system via a power distribution unit.

Abstract: A circuit board with heat sink detection includes a computer-based component with a heat sink associated therewith. The heat sink has a specification and is configured with a unique key representative of the heat sink specification. A key reading device on the circuit board is configured to interact with the unique key and detect the heat sink specification. The key reading device may then transmit a signal indicating the heat sink specification.

Abstract: A circuit board having one or more computer-based components comprises a ground plane, such as a copper sheet, and a dielectric layer overlaying the ground plane. An opening is defined in the dielectric layer such that an area of the ground plane is exposed. A heating device is mounted within the opening and thermally coupled to the ground plane such that energizing the heating device transfers heat to the ground plane.

Abstract: Methods, systems, and devices for providing thermal management of data processing systems that provide computer implemented services are disclosed. To provide such services, a data processing system may include a chassis, a circuit board positioned with the chassis, and a processor positioned with the circuit board and paired with a heatsink adapted to dissipate heat generated by the processor. Additionally, a plurality of hardware components may also be positioned on the circuit board and may also generate heat. To provide thermal management for the data processing system, the plurality of hardware components may be paired with a thermal dissipation component. A shape of the thermal dissipation component may conform to the plurality of hardware components.

Abstract: A cooling manifold for distributing liquid coolant to a plurality of liquid cooled information handling systems includes a temperature sensor, a pressure sensor, and a flow meter for detecting coolant temperature, pressure, and flow rate respectively. The cooling manifold may further be associated with a data acquisition device configured to convert signals representing temperature, pressure, and flow rate from the sensors to data signals and transmit the data signals to a data center building management system via a power distribution unit.

Abstract: A computing device includes a printed circuit board, a base, and a heater apparatus. The printed circuit board is secured to the base. The heater apparatus includes a heater component and a plurality of heater wires, and the heater component is disposed between the printed circuit board and the base.

Abstract: Systems are provided for liquid cooling of an IHS (Information Handling System) installed in a computing rack that includes a liquid cooling manifold. A liquid cooling coupling connects the IHS to the liquid cooling manifold. A busbar of the rack is coupled to the IHS and provides power to the IHS. A leak detection bar is attached to the busbar and includes leak detection sensors that are directed at the liquid cooling coupling connecting the IHS to the liquid cooling manifold.

Abstract: A multi-device chassis air filter characterization system includes a multi-device chassis, an air filter that is included on the multi-device chassis, and a plurality of computing devices that are housed in the multi-device chassis. Each of the computing devices determines that a current time corresponds to a predetermined air filter characterization time period and, in response, operates a cooling system in that computing device at a predetermined cooling system operating level for the predetermined air filter characterization time period. A first computing device that is included in the plurality of computing devices measures an air filtering characteristic provided by the air filter during the predetermined air filter characterization time period and, based on the air filtering characteristic, determines whether to generate an air filter replacement alert.

Abstract: Methods, systems, and devices for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer-implemented services. To provide the computer-implemented services, hardware components of the data processing system may need to operate within certain thermal dissipation requirements. To regulate the temperature of the hardware components, a fan may circulate air through the data processing system when the temperatures fall outside the thermal dissipation requirements. To regulate the temperature of the hardware components more efficiently, higher air flow rates may be desired. To increase air flow rates, a three-dimensional ventilation port may be implemented to de-constrict air flow when air enters or exits the data processing system.

Abstract: Embodiments of the present invention provide a method, anti-static bag, and kit for transporting an electronic component in the anti-static bag. Along with the electronic component, a desiccant and a temperature indicator are added to the anti-static bag. The anti-static bag is then vacuum sealed to reduce the air and moisture in the anti-static bag. The vacuum sealed bag, desiccant, and temperature indicator, insure that the formation of condensation on the electronic component will be minimized, which will potentially prolong the life of the electronic component.

Abstract: An improved method and system for heating and cooling an electronic device, when internal temperatures are below safe operating ranges. To do so, the system selectively heats or cools each zone of the electronic device. This may be done by individual heaters and/or cooling system for each separate zones. Alternatively, or in addition too, the system can selectively open and close baffles, causing fresh ambient air to enter and/or recirculate heated air in a device's enclosure. This keeps sensitive components of the computing device, such as processors and memory from suffering damage, by operating them at temperatures that are either too cold or too warm.

Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may heat them when their temperatures fall outside of thermal operating ranges. The data processing system may implement a distributed management framework for managing the operation of a thermal management subsystem tasked with maintaining the temperatures of the hardware components through heating.

Abstract: A method for managing electromagnetic interference (EMI) includes: obtaining a request; in response to the request: terminating EMI generation by EMI emitting devices in an EMI suppressed internal volume of a data processing device to place the EMI emitting devices in a quiet state; placing the EMI suppressed internal volume into an EMI suppression compromised state to obtain access to the EMI emitting devices in the quiet state; replacing one of the EMI emitting devices in the quiet state, to obtain updated EMI emitting devices, while: the EMI suppressed internal volume is in the EMI suppression compromised state, and the EMI emitting devices are in the quiet state; placing the EMI suppressed internal volume into an EMI suppressed state after replacing the one of the EMI emitting devices; and enabling EMI generation by the updated EMI emitting devices to place the updated EMI emitting devices into an active state.

Abstract: Methods, systems, and devices for providing computer-implemented services are disclosed. To provide the computer-implemented services, hardware components that generate heat may be used. To manage the heat generated by the hardware components, a heat sink assembly may be used. The heat sink assembly may include features for adjusting its shape and/or size to accommodate other nearby components. By accommodating other components, the heat sink assembly may be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference between the heat sink assembly and the other components.

Abstract: Embodiments of the invention may provide an improved method for pre-heating an electronic device such as an information handling system, when internal temperatures are below safe operating ranges. To do so, the system selectively heats the entire device or select zones of the electronic device for a predetermined amount of time when the system is restarted after a period of time sufficient to bring the system to ambient temperatures. The predetermined amount of time is determined based on measured ambient temperatures. Using a table that corresponds the ambient temperatures to a time that a component needs to heat up to a nominal temperature in a zone, the predetermined time can be calculated.

Abstract: A method for managing a data processing device, comprising monitoring a thermal state of an electromagnetic interference (EMI) emitting device disposed in an EMI suppressed internal volume of the data processing device, and managing the thermal state of the EMI emitting device based on the monitoring by modulating a rate of gas flow that traverses through the EMI suppressed internal volume, and is proximate to the EMI emitting device, wherein the EMI suppressed internal volume is delineated by two electromagnetic radiation (EMR) absorbing vents.

Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may heat them when their temperatures fall outside of thermal operating ranges. The data processing system may implement a distributed management framework for managing the operation of a thermal management subsystem tasked with maintaining the temperatures of the hardware components through heating.