Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Abstract: Some embodiments are related to a system for controlling access of a user to a set of equipment of a secure site, including: a communicating portable device associated with the user and containing an identifier of the latter, a biometric activator allowing the opening of a temporary session for the user by means of a biometric authentication, the user being identified by his communicating portable device, and in which the equipment is adapted so as to be usable only in the event of authorization of access by the user after verification of the opening of the temporary session; the user being identified by the equipment by virtue of his communicating portable device.

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Abstract: Embodiments disclosed herein include an electronic system. In an embodiment, the electronic system comprises a board, and a package substrate coupled to the board. In an embodiment, a photonics integrated circuit (PIC) is coupled to the package substrate. In an embodiment, an optical lens is on the PIC, and an optical connector is on the board. In an embodiment, the optical connector passes through an opening through the package substrate and is optically coupled with the optical lens on the PIC.

Abstract: The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Abstract: The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.

Abstract: Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.

Abstract: A method performed by a network device may include generating and storing a first public key and a first private key in a first device, transmitting a serial number and the first public key from the first device to a second device, generating, by the second device, a second public key and a second private key, transmitting the second public key from the second device to the first device and transmitting the serial number, the first public key, the second public key and the second private key to a third device, establishing and authenticating a connection between the first device and the third device using the first public key and the second public key and transmitting encrypted configuration information with the two key pairs from the third device to the first device.

Abstract: A method performed by a network device may include generating and storing a first public key and a first private key in a first device, transmitting a serial number and the first public key from the first device to a second device, generating, by the second device, a second public key and a second private key, transmitting the second public key from the second device to the first device and transmitting the serial number, the first public key, the second public key and the second private key to a third device, establishing and authenticating a connection between the first device and the third device using the first public key and the second public key and transmitting encrypted configuration information with the two key pairs from the third device to the first device.