Abstract: Processing logic in a memory device receives a calibration scan command associated with the memory device. In response to the calibration scan command, execution of a set of read operations at a plurality of read voltage levels on the memory device is caused. In response to the calibration scan command, a set of bit counts is identified, where each bit count of the set of bit counts corresponds to a respective bin of a set of bins associated with the plurality of read voltage levels. Based on the bit count corresponding to each bin of the set of bins, a bin having a lowest bit count is identified.

Abstract: A system can include a processing device operatively coupled with the one or more memory devices, to perform operations that include writing data to the one or more memory devices and performing one or more scan operations on a management unit containing the data to determine a current value of a chosen data state metric. Each scan operation can be performed using a corresponding predetermined read-time parameter value. The operations can include determining whether the current value of the chosen data state metric satisfies a criterion, and can also include, responsive to determining that the current value of the chosen data state metric satisfies the criterion, selecting a remedial operation by determining whether redundancy metadata is included in a fault tolerant data stripe on the one or more memory devices. The operations can also include performing the remedial operation with respect to the management unit.

Abstract: A second read command to read second data from an array of memory cells is detected. An initial voltage to be applied to at least one wordline coupled to at least a subset of the array of memory cells is caused prior to releasing a first data associated with a first read command stored in a page buffer. The initial voltage to increase to a target value is caused. The page buffer to sense the second data from a bitline coupled to a page of the subset of the array of memory cells is caused. The sensed second data out of the bitline into the page buffer is read responsive to determining that the first data has been released from the page buffer.

Abstract: A memory device includes a first memory array, a second memory array, and a page cache circuit coupled to the first memory array and the second memory array. The page cache circuit includes at least one set of concurrent resources and at least one shared resource, wherein the at least one set of concurrent resources are asynchronously and concurrently accessible by the first memory array and the second memory array, and wherein the at least one shared resource is accessible in a time-multiplexed fashion by the first memory array and the second memory array.

Abstract: Control logic in a memory device selects two or more blocks of a plurality of blocks to concurrently scan during a scan operation. The control logic can further cause a first voltage to be applied to a dummy word line of each block of the two or more blocks to selectively couple a string of memory cells in each block of the two or more blocks to a different sense amplifier of a set of sense amplifiers coupled with the plurality of blocks. The control logic can cause a second voltage to be applied to a selected word line of each block of the two or more blocks to read a bit stored at a respective memory cell of the string of memory cells in each block out to the set of sense amplifier.

Abstract: A memory device can include a memory array including memory cells arranged in one or more pages. The memory array can be coupled to control logic to receive a first request to write first data to a page of the one or more pages and program the first data to the page of the one or more pages at a first time responsive to receiving the first request. The control logic is further to receive a second request to write second data to the page of the one or more pages, read the page of the one or more pages, and program the second data to the page of the one or more pages at a second time responsive to receiving the second request. The control logic can also receive an erase request to erase the one or more pages after the second time.

Abstract: A memory device includes a memory array and control logic, operatively coupled to the memory array, to perform operations including causing gate-induced drain leakage (GIDL) to be generated during a seeding operation of a program refresh operation, and causing, during the seeding operation, positive charge carriers generated by the GIDL to be transported to neutralize negative charge carriers generated by the program refresh operation.

Abstract: Systems and methods for two-stage memory cell programming. An example memory device comprises: a memory array; and a controller coupled to the memory array, the controller to perform operations comprising: receiving a request to perform a memory programming operation with respect to a target set of memory cells electrically coupled to a target wordline and a set of target bitlines; performing a first stage of the memory programming operation by causing a ramping up programming voltage to be applied to the target wordline while causing one or more pillars associated with the target memory cells to be boosted in a staggered manner; and performing a second stage of the memory programming operation by causing a programming voltage to be applied to the target wordline, while selectively applying bias voltage to the set of target bitlines.

Abstract: Memories might include an array of memory cells having a plurality of strings of series-connected memory cells each formed around a respective channel material structure, and a controller configured to determine a data state stored to a selected string of series-connected memory cells in response to charge stored to its respective channel material structure.

Abstract: Control logic in a memory device causes a pass voltage to be applied to a plurality of wordlines of a block of a memory array of the memory device, the block comprising a plurality of sub-blocks, and the pass voltage to boost a channel potential of each of the plurality of sub-blocks to a boost voltage. The control logic further selectively discharges the boost voltage from one or more of the plurality of sub-blocks according to a data pattern representing a sequence of bits to be programmed to respective memory cells of the plurality of sub-blocks. In addition, the control logic causes a single programming pulse to be applied to a selected wordline of the plurality of wordlines of the block to program the respective memory cells of the plurality of sub-blocks according to the data pattern.

Abstract: A memory device includes a memory array including wordlines and at least one string of cells. Each cell of the at least one string of cells is addressable by a respective wordline. The memory device further includes control logic, operatively coupled to the memory array, to perform operations including generating gate-induced drain leakage (GIDL) with respect to the at least one string of cells, and causing a grounding voltage to be applied to a set of wordlines to ground each cell of the at least one string of cells addressable by each wordline of the set of wordlines. The grounding voltage applied to the set of wordlines enables transport of positive charge carriers generated by the GIDL. In some embodiments, the positive charge carriers neutralize a buildup of negative charge carriers generated during a seeding phase of a program refresh operation.

Abstract: A memory device includes a memory array with a plurality of memory cells formed at respective intersections of a plurality of wordlines and a plurality of bit lines. The memory device further includes a page buffer circuit coupled to the memory array, the page buffer circuit having a plurality of dynamic latch circuits to store values representing respective data line bias voltages to be applied to the plurality of bit lines. Each of the plurality of dynamic latch circuits includes a storage element to store a value representing a respective data line bias voltage, a first switch and a second switch in a load path coupled to the storage element, wherein the value is loaded into the storage element via the load path with the first and second switches are activated, and a third switch in a decode path coupled the first switch in the load path, wherein the third switch is controlled by a shared decode load control signal.

Abstract: Control logic in a memory device initiates a program operation on a memory array of a memory device, the memory array comprising a plurality of memory cells, and the program operation comprising a plurality of program pulses. The control logic further identifies a first subset of the plurality of memory cells and a second subset of the plurality of memory cells based on respective threshold voltages after application of a first program pulse of the plurality of program pulses, and boosts a voltage potential in one or more pillars of the memory array corresponding to the first subset of the plurality of memory cells prior to application of a second program pulse of the plurality of program pulses.

Abstract: Described are systems and methods for validating read level voltage in memory devices. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines; and a controller coupled to the memory array, the controller to perform operations comprising: causing a read level voltage to be applied to a specified wordline of the plurality of wordlines; determining a read level adjustment as a function of a sequential number of a margin valley corresponding to the read level voltage; and adjusting the read level voltage by applying, to the read level voltage, the read level adjustment.

Abstract: A memory device can include a memory array and control logic, operatively coupled with the memory array, to perform operations including identifying a first base state information bin associated with a first index value and a second base state information bin associated with a second index value, determining a third index value based on the first index value and the second index value, assigning a target cell of the memory array to a target cell state information bin associated with the third index value, and causing the target cell, assigned to the target cell state information bin, to be read.

Abstract: Memories might include an array of memory cells having a plurality of strings of series-connected memory cells and a controller configured to cause to memory to access a first string of series-connected memory cells of the plurality of strings of series-connected memory cells in a first mode of operation for volatile storage of data to the first string of series-connected memory cells, and access a second string of series-connected memory cells of the plurality of strings of series-connected memory cells in a second mode of operation for non-volatile storage of respective data to each memory cell of a plurality of memory cells of the second string of series-connected memory cells

Abstract: An apparatus is provided, comprising a substrate with a frontside and a backside opposite the frontside; control circuitry disposed over the frontside of the substrate; a memory array disposed over and electrically coupled to the control circuitry; a through-silicon via (TSV) disposed under the memory array, the TSV extending through the substrate from the control circuitry to the backside of the substrate; and a bond pad disposed on the backside of the substrate and electrically coupled to the control circuitry via the TSV.

Abstract: Exemplary methods, apparatuses, and systems include an adaptive pre-read manager for controlling pre-reads of the memory device. The adaptive pre-read manager receives a first set of data bits for programming to memory. The adaptive pre-read manager performing a first pass of programming including a first subset of data bits from the set of data bits. The adaptive pre-read manager compares a set of threshold operating differences to a set of differences between multiple operating conditions during the first pass of programming and current operating conditions. The adaptive pre-read manager performs an internal pre-read of the programmed first subset of data bits. The adaptive pre-read manager performs a second pass of programming using the internal pre-read and a second subset of data bits from the first set of data bits.

Abstract: Control logic in a memory device determines to initiate a string read operation on a first memory string of a plurality of memory strings in a block of a memory array, the block comprising a plurality of wordlines, wherein the first memory string is designated as a sacrificial string. The control logic further causes a read voltage to be applied to each of the plurality of wordlines concurrently and senses a level of current flowing through the sacrificial string while the read voltage is applied. In addition, the control logic identifies, based on the level of current flowing through the sacrificial string, whether a threshold level of read disturb has occurred on the block.

Abstract: A memory system includes a ready busy pin coupled with a plurality of dice and a processing device coupled with the ready busy pin. The processing device is to perform controller operations including waiting to perform any status checks until after assertion of a pulse on a status indicator signal received from the ready busy pin; detecting the pulse being asserted is an extended pulse comprising at least a partial overlap of a first pulse asserted by a first die and a second pulse asserted by a second die of the plurality of dice; initiating a polling delay period in response to detecting assertion of the extended pulse, wherein the polling delay period is greater than a pulse width of the first pulse; and initiating a first status check of dice operations being performed by the plurality of dice in response to detecting expiration of the polling delay period.