Patents by Inventor Eric N. Phan

Eric N. Phan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DUAL LEVEL CONTACT DESIGN FOR AN INTERCONNECT SYSTEM IN POWER APPLICATIONS
    Publication number: 20130344748
    Abstract: Various embodiments provide an interconnect system for power applications. The interconnect system includes a receptacle comprising a first conductive wall. At least a second conductive wall is situated opposite the first conductive wall. The receptacle further includes a first end and a second end situated opposite the first end. A first sacrificial contact area is situated on the first conductive wall. At least a second sacrificial contact area is situated on the second conductive wall. A first conductive contact area is situated on the first conductive wall. At least a second conductive contact area is situated on the second conductive wall. The conductive contact areas are situated closer to the first end than the sacrificial contact areas. The sacrificial contact areas are configured to contact a sacrificial portion of the header prior to a conductive portion of the header contacting the conductive contact areas of the receptacle.
    Type: Application
    Filed: June 21, 2012
    Publication date: December 26, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Eric N. PHAN
  • Dual level contact design for an interconnect system in power applications
    Patent number: 8613626
    Abstract: Various embodiments provide an interconnect system for power applications. The interconnect system includes a receptacle comprising a first conductive wall. At least a second conductive wall is situated opposite the first conductive wall. The receptacle further includes a first end and a second end situated opposite the first end. A first sacrificial contact area is situated on the first conductive wall. At least a second sacrificial contact area is situated on the second conductive wall. A first conductive contact area is situated on the first conductive wall. At least a second conductive contact area is situated on the second conductive wall. The conductive contact areas are situated closer to the first end than the sacrificial contact areas. The sacrificial contact areas are configured to contact a sacrificial portion of the header prior to a conductive portion of the header contacting the conductive contact areas of the receptacle.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: December 24, 2013
    Assignee: International Business Machines Corporation
    Inventor: Eric N. Phan