Patents by Inventor Eric Nguyen Phan

Eric Nguyen Phan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering of end chip components in series
    Patent number: 11641717
    Abstract: A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 2, 2023
    Assignee: International Business Machines Corporation
    Inventors: John R. Dangler, Theron Lee Lewis, David J. Braun, Eric Nguyen Phan
  • SOLDERING OF END CHIP COMPONENTS IN SERIES
    Publication number: 20230061076
    Abstract: A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: John R. Dangler, Theron Lee Lewis, David J. Braun, Eric Nguyen Phan