Abstract: The present invention relates to an electronic circuit unit having at least one semiconductor (15), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections (20) each have a contact surface (17) situated on the substrate (12) which, when the substrate (12) and the housing (2) are joined together, comes to lie in an opposing position to the counter-contact surfaces (19) of the contact paths (21). The present invention also relates to a corresponding manufacturing method.

Abstract: In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.