Patents by Inventor Eric Oswald

Eric Oswald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10709776
    Abstract: The present invention relates to ex vivo method for producing outer membrane vesicles (OMVs) by expression or overexpression of the hemolysin F gene (hlyF) in gram-negative bacterium.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: July 14, 2020
    Assignees: INSERM (INSTITUT NATIONAL DE LA SANTÉ ET DE LA RECHERCHE MÉDICALE), CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS), INSTITUT NATIONAL DE RECHERCHE POUR L'AGRICULTURE, L'ALIMENTATION ET L'ENVIRONNEMENT, UNIVERSITÉ PAUL SABATIER TOULOUSE III, CENTRE HOSPITALIER UNIVERSITAIRE DE TOULOUSE
    Inventors: Eric Oswald, Patricia Martin, Kazunori Murase
  • Publication number: 20200048187
    Abstract: The invention is based on the discovery of a new bacterial compound with analgesic properties which could be used as a new tool for the treatment of pain disorders such as visceral pain. Studying the mechanisms implicated in analgesic properties of the probiotic Escherichia coli strain Nissle 1917 (EcN), inventors characterized, the amino fatty acids produced by EcN, which display the Ecn analgesic properties. One of these compounds inhibits the hypersensitivity to colorectal distension induced by capsaicin, which is a very powerful nociceptive compound and acts via the GABA B receptor. Furthermore, inventors demonstrate that this compound is able to cross the cellular epithelial barrier (such as the intestinal epithelium). Thus, the invention relates to a lipopetide compound, derived from gamma-aminobutyric acid. The invention also relates to a lipopeptide compound according to the invention for the treatment of treating pain disorder, such as somatic pain and visceral pain.
    Type: Application
    Filed: April 27, 2018
    Publication date: February 13, 2020
    Inventors: Nicolas CENAC, Justine BERTRAND-MICHEL, Teresa PEREZ-BEREZO, Thierry DURAND, Jean-Marie GALANO, Julien PUJO, Eric OSWALD, Patricia MARTIN, Pauline LE FAOUDER, Alexandre GUY
  • Publication number: 20170112913
    Abstract: The present invention relates to ex vivo method for producing outer membrane vesicles (OMVs) by expression or overexpression of the hemolysin F gene (hlyF) in gram-negative bacterium.
    Type: Application
    Filed: April 7, 2014
    Publication date: April 27, 2017
    Inventors: Eric OSWALD, Patricia MARTIN, Kazunori MURASE
  • Patent number: 9157010
    Abstract: A magnetorheological fluid for use in magnetorheological ultrasmooth polishing of a substrate surface, comprising an aqueous carrier vehicle; a first amount of magnetic particles having a average diameter between about 1 micrometer and about 2 micrometers; and a second amount of abrasive particles having an average diameter between about <1 nanometer and about 15 nanometers. The fluid may further comprise a chemical stabilizer. Preferably the size of the magnetic particles is 2 to 3 orders of magnitude greater than the size of the abrasive particles. Preferably, the magnetic particles are spherical and include carbonyl iron, and preferably, the abrasive particles are selected from the group consisting of aluminum oxide, zirconium oxide, cerium oxide, silica, boron carbide, silicon carbide, natural diamond, synthetic diamond, and combinations thereof.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: October 13, 2015
    Assignee: Cabot Microelectronics Corporation
    Inventors: William Kordonski, Sergei Gorodkin, Eric Oswald
  • Publication number: 20140020305
    Abstract: A magnetorheological fluid for use in magnetorheological ultrasmooth polishing of a substrate surface, comprising an aqueous carrier vehicle; a first amount of magnetic particles having a average diameter between about 1 micrometer and about 2 micrometers; and a second amount of abrasive particles having an average diameter between about <1 nanometer and about 15 nanometers. The fluid may further comprise a chemical stabilizer. Preferably the size of the magnetic particles is 2 to 3 orders of magnitude greater than the size of the abrasive particles. Preferably, the magnetic particles are spherical and include carbonyl iron, and preferably, the abrasive particles are selected from the group consisting of aluminum oxide, zirconium oxide, cerium oxide, silica, boron carbide, silicon carbide, natural diamond, synthetic diamond, and combinations thereof.
    Type: Application
    Filed: July 18, 2012
    Publication date: January 23, 2014
    Inventors: William KORDONSKI, Sergei GORODKIN, Eric OSWALD
  • Patent number: 8277798
    Abstract: The present invention relates to the use of cells containing in their genome a specific DNA molecule, as cytopathic agents able to inhibit the proliferation of cells, when these proliferative cells are contacted with the cells containing the above-mentioned DNA molecule.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: October 2, 2012
    Assignees: Institut National de la Recherche Agronomique, Bayerische Julius-Maximilians-Universitat Wurzburg
    Inventors: Eric Oswald, Jörg Hacker, Jean Philippe Nougayrede, Ulrich Dobrindt, Frédéric Taieb, Fabrice Pierre
  • Patent number: 7696095
    Abstract: The present invention provides auto-stopping CMP slurry compositions that minimize post-CMP non-uniformity and also extend the time that polishing can be continued beyond the end point without the risk of over-polishing the dielectric silicon dioxide film. Auto-stopping CMP slurry compositions according to the invention include ceria abrasive particles and an effective amount of a polyalkylamine such as polyethyleneimine dispersed in water. The methods of the invention include polishing a topographic dielectric silicon dioxide film layer using the auto-stopping CMP slurry compositions to obtain a dielectric silicon dioxide surface having a desired predetermined minimum step height.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: April 13, 2010
    Assignee: Ferro Corporation
    Inventors: Eric Oswald, Sean Frink, Bradley Kraft, Brian Santora
  • Publication number: 20090238804
    Abstract: The present invention relates to the use of cells containing in their genome a specific DNA molecule, as cytopathic agents able to inhibit the proliferation of cells, when these proliferative cells are contacted with the cells containing the above-mentioned DNA molecule.
    Type: Application
    Filed: May 10, 2007
    Publication date: September 24, 2009
    Applicant: INSTITUT NATIONAL DE LA RECHERCHE AGRONOMIQUE
    Inventors: Eric Oswald, Jörg Hacker, Jean Philippe Nougayrede, Ulrich Dobrindt, Frederic Taieb, Fabrice Pierre
  • Publication number: 20080202037
    Abstract: The present invention provides auto-stopping CMP slurry compositions that minimize post-CMP non-uniformity and also extend the time that polishing can be continued beyond the end point without the risk of over-polishing the dielectric silicon dioxide film. Auto-stopping CMP slurry compositions according to the invention include ceria abrasive particles and an effective amount of a polyalkylamine such as polyethyleneimine dispersed in water. The methods of the invention include polishing a topographic dielectric silicon dioxide film layer using the auto-stopping CMP slurry compositions to obtain a dielectric silicon dioxide surface having a desired predetermined minimum step height.
    Type: Application
    Filed: February 23, 2007
    Publication date: August 28, 2008
    Applicant: FERRO CORPORATION
    Inventors: Eric Oswald, Sean Frink, Bradley Kraft, Brian Santora
  • Publication number: 20060216935
    Abstract: The present invention provides an oxide CMP slurry composition for use in planarizing silicon oxide-containing films via CMP during CMOS device fabrication, and a method of planarizing silicon oxide-containing films via CMP using the slurry composition. The oxide CMP slurry composition according to the invention includes: (i) proline, lysine and/or arginine; (ii) a pyrrolidone compound; and (iii) abrasive particles. Proline is presently most preferred for use in the invention. In the STI sub-process of the CMOS device fabrication process, the oxide CMP slurry composition according to the present invention acts to aggressively remove only the silicon dioxide overburden on the processed wafer that is in contact with a polishing pad, which results in the formation of a substantially planar, defect-free surface.
    Type: Application
    Filed: March 28, 2005
    Publication date: September 28, 2006
    Applicant: Ferro Corporation
    Inventors: Eric Oswald, Yue Liu
  • Patent number: 6616514
    Abstract: The present invention provides a chemical mechanical polishing slurry for use in removing a first substance from a surface of an article in preference to silicon nitride by chemical mechanical polishing. The chemical mechanical polishing slurry according to the invention includes an abrasive, an aqueous medium, and an organic polyol that does not dissociate protons, said organic polyol including a compound having at least three hydroxyl groups that are not dissociable in the aqueous medium, or a polymer formed from at least one monomer having at least three hydroxyl groups that are not dissociable in the aqueous medium. In the preferred embodiment, ceria particles are used as the abrasive and the organic polyol is selected from the group consisting of mannitol, sorbitol, mannose, xylitol, sorbose, sucrose, and dextrin. The chemical mechanical polishing slurry can further optionally include acids or bases for adjusting the pH within an effective range of from about 2 to about 12.
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: September 9, 2003
    Assignee: Ferro Corporation
    Inventors: Brian Edelbach, Eric Oswald, Yie-Shein Her