Abstract: A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping old or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

Abstract: An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.

Abstract: A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping a gold or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

Abstract: Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach circuitized chips. The land area is temporarily extended by depositing a relatively thin layer of metal beyond the perimeter of the land, wave soldering to deposit excess solder on the extended land region, and reflow, whereby the thin layer of metal dissolves into the solder, causing the solder to retract to the dimensions of the original land. Because the volume of solder is increased, the strength and reliability of the solder joint is greatly improved.

Abstract: A connector for connecting a circuit carrier to a board or card that includes a contact pin having a stem portion and a head portion. The head portion contains at least one hertz dot thereon. The outer surface of the hertz dot is gold.

Abstract: A composition of a metallic compound represented by the formula MT, and G is provided by sputtering an M.sub.x G.sub.100-x target. M is a metal selected from the group of titanium, hafnium, zirconium, and mixtures thereof. T is selected from the group of N, C, and mixtures thereof. G is a metal selected from the group of gold, platinum, and palladium. X is an integer from about 65 to about 95. Also provided are substances coated with the composition and process for depositing the composition on substrates.

Abstract: A composition of a metallic compound represented by the formula MT, and G is provided by sputtering an M.sub.x G.sub.100-x target. M is a metal selected from the group of titanium, hafnium, zirconium, and mixtures thereof. T is selected from the group of N, C, and mixtures thereof. G is a metal selected from the group of gold, platinum, and palladium. X is an integer from about 65 to about 95. Also provided are substrates coated with the composition and process for depositing the composition on substrates.

Abstract: A low conductivity fluid mask in a predetermined fluid state is used as a mask in an electroplating jet system method. Preferred embodiments describe a deionized water mask in the liquid fluid state.