Patents by Inventor Eric P. Lewandowski
Eric P. Lewandowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180040859Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.Type: ApplicationFiled: October 20, 2017Publication date: February 8, 2018Inventors: Paul S. Andry, Eric P. Lewandowski, Yu Luo, Adinath S. Narasgond
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Patent number: 9806299Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.Type: GrantFiled: July 24, 2014Date of Patent: October 31, 2017Assignee: International Business Machines CorporationInventors: Paul S. Andry, Eric P. Lewandowski, Yu Luo, Adinath S. Narasgond
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Patent number: 9738560Abstract: A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.Type: GrantFiled: May 24, 2016Date of Patent: August 22, 2017Assignee: International Business Machines CorporationInventors: Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang, Eric P. Lewandowski, Xiao Hu Liu, Kenneth P. Rodbell, Thomas M. Shaw
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Publication number: 20170125329Abstract: A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.Type: ApplicationFiled: October 30, 2015Publication date: May 4, 2017Inventors: Eric P. Lewandowski, Jae-Woong Nah, Peter J. Sorce
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Publication number: 20170119960Abstract: A digital biomedical device includes a substrate forming a cavity, a seal formed around the cavity, a lid coupled to the substrate by the seal, a reactive metal structure comprising a plurality of metal layers, wherein the reactive metal structure is a component of at least one of the substrate and the lid, a metal trace configured to initiate a self-propagating reaction between the plurality of metal layers of the reactive metal structure and release contents of the cavity, and a power supply configured to apply an electric current to the metal traceType: ApplicationFiled: October 30, 2015Publication date: May 4, 2017Inventors: BING DANG, GREGORY M. FRITZ, ERIC P. LEWANDOWSKI, JOANA S.B.T. MARIA, BUCKNELL C. WEBB, STEVEN L. WRIGHT
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Patent number: 9586857Abstract: A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.Type: GrantFiled: April 30, 2015Date of Patent: March 7, 2017Assignee: International Business Machines CorporationInventors: Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang, Eric P. Lewandowski, Xiao Hu Liu, Kenneth P. Rodbell, Thomas M. Shaw
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Patent number: 9508566Abstract: Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.Type: GrantFiled: August 15, 2014Date of Patent: November 29, 2016Assignee: International Business Machines CorporationInventors: Paul S Andry, Bing Dang, Eric P Lewandowski, Jae-Woong Nah, Bucknell C Webb
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Patent number: 9472789Abstract: A microsystem with an integrated energy source serves as a platform and ecosystem for a variety of microsystems for implanting into human tissue. The microsystem includes a flexible battery located in an enclosed void. The enclosed void is formed by joining a first dielectric element with a second dielectric element.Type: GrantFiled: July 24, 2014Date of Patent: October 18, 2016Assignee: International Business Machines CorporationInventors: Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski, Cornelia K. Tsang, Bucknell C. Webb
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Publication number: 20160264456Abstract: A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.Type: ApplicationFiled: May 24, 2016Publication date: September 15, 2016Inventors: Cyril Cabral, JR., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang, Eric P. Lewandowski, Xiao Hu Liu, Kenneth P. Rodbell, Thomas M. Shaw
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Publication number: 20160137548Abstract: A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.Type: ApplicationFiled: April 30, 2015Publication date: May 19, 2016Inventors: Cyril Cabral, JR., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang, Eric P. Lewandowski, Xiao Hu Liu, Kenneth P. Rodbell, Thomas M. Shaw
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Patent number: 9321245Abstract: A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.Type: GrantFiled: June 24, 2013Date of Patent: April 26, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Michael A. Gaynes, Eric P. Lewandowski, Jae-Woong Nah, Robert J. Polastre
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Publication number: 20160049344Abstract: Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.Type: ApplicationFiled: August 15, 2014Publication date: February 18, 2016Inventors: Paul S. Andry, Bing Dang, Eric P. Lewandowski, Jae-Woong Nah, Bucknell C Webb
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Patent number: 9181440Abstract: An electrically conductive paste providing low alpha particle emission is provided. A resin and conductive particles are mixed, and a curing agent is added. A solvent is subsequently added. The electrically conductive paste including a resin compound is formed by mixing the mixture in a high shear mixer. The electrically conductive paste can be applied to a surface of an article to form a coating, or can be molded into an article. The solvent is evaporated, and the electrically conductive paste is cured to provide a graphite-containing resin compound. The graphite-containing resin compound is electrically conductive, and provides low alpha particle emission at a level suitable for a low alpha particle emissivity coating.Type: GrantFiled: August 29, 2013Date of Patent: November 10, 2015Assignee: GLOBALFOUNDRIES U.S. 2 LLCInventors: Michael A. Gaynes, Michael S. Gordon, Eric P. Lewandowski
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Publication number: 20150288024Abstract: A battery, comprising a cathode comprising a cathode material in contact with a cathode current collector. The battery also comprises an electrolyte. The battery also comprises an anode comprising an electroplated homogeneous solid metallic alloy comprising 100 ppm to 1000 ppm Bi and 100 ppm to 1000 ppm In, and a remainder Zn.Type: ApplicationFiled: July 24, 2014Publication date: October 8, 2015Inventors: Paul S. Andry, Gregory M. Fritz, Michael S. Gordon, Eric P. Lewandowski, Yu Luo
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Publication number: 20150287960Abstract: A system comprising a first dielectric element and a second dielectric element each having a first surface, wherein the first surface of the first dielectric element and the first surface of the second dielectric element are joined. The system further comprises one or more enclosed voids within the joined first and second dielectric elements. The system further comprises a flexible battery in a first enclosed void of the one or more enclosed voids, the flexible battery having a thickness of less than about 150 microns.Type: ApplicationFiled: July 24, 2014Publication date: October 8, 2015Inventors: Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski, Cornelia K. Tsang, Bucknell C. Webb
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Publication number: 20150288023Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.Type: ApplicationFiled: July 24, 2014Publication date: October 8, 2015Inventors: Paul S. Andry, Eric P. Lewandowski, Yu Luo, Adinath S. Narasgond
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Publication number: 20150137366Abstract: An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.Type: ApplicationFiled: January 30, 2015Publication date: May 21, 2015Inventors: Gregory M. Fritz, Eric P. Lewandowski
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Patent number: 8987130Abstract: An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.Type: GrantFiled: May 29, 2012Date of Patent: March 24, 2015Assignee: International Business Machines CorporationInventors: Gregory M. Fritz, Eric P. Lewandowski
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Publication number: 20140377571Abstract: A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.Type: ApplicationFiled: June 24, 2013Publication date: December 25, 2014Inventors: Michael A. Gaynes, Eric P. Lewandowski, Jae-Woong Nah, Robert J. Polastre
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Publication number: 20140377572Abstract: A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.Type: ApplicationFiled: September 12, 2013Publication date: December 25, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Gaynes, Eric P. Lewandowski, Jae-Woong Nah, Robert J. Polastre