Abstract: Apparatus and methods for applying solder paste to circuits, such as integrated circuits, are disclosed. The apparatus and methods comprise a squeegee blade having a pair of elongated face sides spaced apart by a selected thickness and a corresponding pair of elongated substantially parallel narrow sides spaced apart by a selected width. The elongated face sides and elongated narrow sides join together to form squeegee operating edges. The squeegee blade is free of mounting aperture as to provide four operating edges. The squeegee blade is mounted to a resilient clamping structure which applies a regular and controlled gripping force so as to avoid deformation of the squeegee blade edge due to excessive mounting force. The plurality of fasteners are received by the clamping structure for adjusting the gripping force to the squeegee blade.

Abstract: Apparatus and methods for applying solder paste to circuits, such as integrated circuits, are disclosed. The apparatus and methods comprise a squeegee blade having a pair of elongated face sides spaced apart by a selected thickness and a corresponding pair of elongated substantially parallel narrow sides spaced apart by a selected width. The elongated face sides and elongated narrow sides join together to form squeegee operating edges. The squeegee blade is free of mounting aperture as to provide four operating edges. The squeegee blade is mounted to a resilient clamping structure which applies a regular and controlled gripping force so as to avoid deformation of the squeegee blade edge due to excessive mounting force. The plurality of fasteners are received by the clamping structure for adjusting the gripping force to the squeegee blade.

Abstract: Apparatus and methods for applying solder paste to circuits, such as integrated circuits, are disclosed. The apparatus and methods comprise a squeegee blade having a pair of elongated face sides spaced apart by a selected thickness and a corresponding pair of elongated substantially parallel narrow sides spaced apart by a selected width. The elongated face sides and elongated narrow sides join together to form squeegee operating edges. The squeegee blade is free of mounting aperture as to provide four operating edges. The squeegee blade is mounted to a resilient clamping structure which applies a regular and controlled gripping force so as to avoid deformation of the squeegee blade edge due to excessive mounting force. The plurality of fasteners are received by the clamping structure for adjusting the gripping force to the squeegee blade.

Abstract: Apparatus and methods for removing solder ball connections from electrical circuits are disclosed. The apparatus and methods comprise a solder ball removing tool 20 having a multiplicity of raised ribs 22 defining a contact surface 24 and made up of heat conductive material having a melting point above the melting point of solder. There is also included a heating source 30 for heating at least a portion of the multiplicity of raised ribs 22 to a temperature sufficient to melt the solder and yet below the melting temperature of the conductive material. The tool 20 is preferably supported or constructed such that the contact surface is tilted so that the melted solder will run down the raised ribs into a collecting pan 46.

Abstract: Apparatus and methods for removing solder ball connections from electrical circuits are disclosed. The apparatus and methods comprise a solder ball removing tool 20 having a multiplicity of raised ribs 22 defining a contact surface 24 and made up of heat conductive material having a melting point above the melting point of solder. There is also included a heating source 30 for heating at least a portion of the multiplicity of raised ribs 22 to a temperature sufficient to melt the solder and yet below the melting temperature of the conductive material. The tool 20 is preferably supported or constructed such that the contact surface is tilted so that the melted solder will run down the raised ribs into a collecting pan 46.