Patents by Inventor Eric Peter Lewandowski
Eric Peter Lewandowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11895932Abstract: Techniques regarding selectively tuning the operating frequency of superconducting Josephson junction resonators are provided. For example, one or more embodiments described herein can comprise a method that can include chemically altering a Josephson junction of a Josephson junction resonator via a plasma treatment. The method can also comprise selectively tuning an operating frequency of the Josephson junction resonator based on a property of the plasma treatment.Type: GrantFiled: June 25, 2020Date of Patent: February 6, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Peter Lewandowski, Jeng-Bang Yau, Eric Zhang, Bucknell C Webb
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Patent number: 11749605Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.Type: GrantFiled: December 9, 2020Date of Patent: September 5, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond
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Publication number: 20220020715Abstract: Systems and techniques that facilitate uniform qubit chip gaps via injection-molded solder pillars are provided. In various embodiments, a device can comprise one or more injection-molded solder interconnects. In various aspects, the one or more injection-molded solder interconnects can couple at least one qubit chip to an interposer chip. In various embodiments, the device can further comprise one or more injection-molded solder pillars. In various instances, the one or more injection-molded solder pillars can be between the at least one quit chip and the interposer chip. In various cases, the one or more injection-molded solder pillars can be in parallel with the one or more injection-molded solder interconnects. In various embodiments, the one or more injection-molded solder pillars can facilitate and/or maintain a uniform gap between the at least one qubit chip and the interposer chip.Type: ApplicationFiled: July 17, 2020Publication date: January 20, 2022Inventors: Eric Peter Lewandowski, Jae-Woong Nah, Dongbing Shao
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Publication number: 20210408360Abstract: Techniques regarding selectively tuning the operating frequency of superconducting Josephson junction resonators are provided. For example, one or more embodiments described herein can comprise a method that can include chemically altering a Josephson junction of a Josephson junction resonator via a plasma treatment. The method can also comprise selectively tuning an operating frequency of the Josephson junction resonator based on a property of the plasma treatment.Type: ApplicationFiled: June 25, 2020Publication date: December 30, 2021Inventors: Eric Peter Lewandowski, Jeng-Bang Yau, Eric Zhang, Bucknell C Webb
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Patent number: 11195799Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.Type: GrantFiled: March 31, 2020Date of Patent: December 7, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dongbing Shao, Eric Peter Lewandowski, Nicholas Torleiv Bronn, Markus Brink
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Patent number: 11165010Abstract: In an embodiment, a quantum device includes a first set of protrusions formed on a substrate and a second set of protrusions formed on a qubit chip. In the embodiment, the quantum device includes a set of bumps formed on an interposer, the set of bumps formed of a material having above a threshold ductility at a room temperature range, wherein a first subset of the set of bumps is configured to cold weld to the first set of protrusions and a second subset of the set of bumps is configured to cold weld to the second set of protrusions.Type: GrantFiled: February 11, 2019Date of Patent: November 2, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Peter Lewandowski, Jae-Woong Nah, Nicholas Torleiv Bronn
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Publication number: 20210305165Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.Type: ApplicationFiled: March 31, 2020Publication date: September 30, 2021Inventors: Dongbing Shao, Eric Peter Lewandowski, Nicholas Torleiv Bronn, Markus Brink
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Patent number: 11043690Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.Type: GrantFiled: January 2, 2019Date of Patent: June 22, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jae-Woong Nah, Paul S. Andry, Eric Peter Lewandowski, Bucknell C. Webb, Adinath Shantinath Narasgond, Bo Wen
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Publication number: 20210118808Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.Type: ApplicationFiled: December 9, 2020Publication date: April 22, 2021Inventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond
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Publication number: 20210091372Abstract: A method of forming a thin film battery may include forming may include forming a trench in a substrate, depositing a stencil on top surface of the substrate, wherein the stencil is aligned with the trench, depositing a cathode layer in the trench, wherein the cathode layer is in direct contact with the stencil, and compressing the cathode layer into the trench to reduce a thickness of the cathode layer. The compressing the cathode layer into the trench may include applying isostatic pressure onto the cathode layer using a pressure head. The method may also include depositing an electrolyte layer on top of the cathode layer, depositing an anode layer on top of the electrolyte layer, and depositing an anode collector layer on top of the anode layer.Type: ApplicationFiled: September 23, 2019Publication date: March 25, 2021Inventors: Paul S. Andry, Eric Peter Lewandowski, Dana Alexa Totir
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Patent number: 10937735Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.Type: GrantFiled: September 20, 2018Date of Patent: March 2, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond
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Publication number: 20210028138Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.Type: ApplicationFiled: August 11, 2020Publication date: January 28, 2021Applicant: International Business Machines CorporationInventors: Eric Peter Lewandowski, Jae-Woong Nah, Jeng-Bang Yau, Peter Jerome Sorce
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Patent number: 10879202Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.Type: GrantFiled: July 26, 2019Date of Patent: December 29, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Peter Lewandowski, Jae-Woong Nah, Jeng-Bang Yau, Peter Jerome Sorce
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Patent number: 10833241Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.Type: GrantFiled: June 20, 2019Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Peter Lewandowski, Bucknell C. Webb, Jared Barney Hertzberg, Martin O. Sandberg, Oblesh Jinka
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Publication number: 20200259064Abstract: In an embodiment, a quantum device includes a first set of protrusions formed on a substrate and a second set of protrusions formed on a qubit chip. In the embodiment, the quantum device includes a set of bumps formed on an interposer, the set of bumps formed of a material having above a threshold ductility at a room temperature range, wherein a first subset of the set of bumps is configured to cold weld to the first set of protrusions and a second subset of the set of bumps is configured to cold weld to the second set of protrusions.Type: ApplicationFiled: February 11, 2019Publication date: August 13, 2020Applicant: International Business Machines CorporationInventors: Eric Peter Lewandowski, Jae-Woong Nah, Nicholas Torleiv Bronn
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Publication number: 20200212475Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.Type: ApplicationFiled: January 2, 2019Publication date: July 2, 2020Inventors: Jae-Woong Nah, Paul S. Andry, Eric Peter Lewandowski, Bucknell C. Webb, Adinath Shantinath Narasgond, Bo Wen
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Publication number: 20200098695Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.Type: ApplicationFiled: September 20, 2018Publication date: March 26, 2020Inventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond
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Patent number: 9586291Abstract: Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.Type: GrantFiled: March 27, 2014Date of Patent: March 7, 2017Assignee: GLOBALFOUNDRIES INCInventors: Bing Dang, John U. Knickerbocker, Eric Peter Lewandowski, Cornelia Kang-I Tsang
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Publication number: 20150035173Abstract: Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.Type: ApplicationFiled: March 27, 2014Publication date: February 5, 2015Applicant: International Business Machines CorporationInventors: Bing Dang, John U. Knickerbocker, Eric Peter Lewandowski, Cornelia Kang-I Tsang