Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract: An apparatus for filling filtered solder into replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a cartridge support, an environmentally-controlled chamber, a solder receptacle, a heater, a molten solder flow conduit, and a separator.

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a substrate support, a replaceable solder cartridge, and a solder ejector. The replaceable solder cartridge defines a cavity for containing solder and has an orifice for ejecting a continuous stream of molten solder. The solder ejector has a mechanism for retaining the replaceable solder cartridge during solder deposition and is positioned relative to the substrate support to deposit molten solder ejected from the orifice of the replaceable solder cartridge onto the substrate.