Patents by Inventor Eric Phillips

Eric Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5938102
    Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.
    Type: Grant
    Filed: January 5, 1996
    Date of Patent: August 17, 1999
    Inventors: Eric Phillip Muntz, Melissa E. Orme-Marmarelis, Gerald C. Pham-Van-Diep, Robert J. Balog
  • Patent number: 5894985
    Abstract: An apparatus for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a substrate support, a replaceable solder cartridge, and a solder ejector. The replaceable solder cartridge defines a cavity for containing solder and has an orifice for ejecting a continuous stream of molten solder. The solder ejector has a mechanism for retaining the replaceable solder cartridge during solder deposition and is positioned relative to the substrate support to deposit molten solder ejected from the orifice of the replaceable solder cartridge onto the substrate.
    Type: Grant
    Filed: September 24, 1996
    Date of Patent: April 20, 1999
    Assignee: Rapid Analysis Development Company
    Inventors: Melissa E. Orme-Marmarelis, Eric Phillip Muntz
  • Patent number: 5894980
    Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.
    Type: Grant
    Filed: September 23, 1996
    Date of Patent: April 20, 1999
    Assignee: Rapid Analysis Development Comapny
    Inventors: Melissa E. Orme-Marmarelis, Eric Phillip Muntz
  • Patent number: 3964949
    Abstract: A method of treading or re-treading tires involves compression of the wearing surface of the tread. A tread strip, which may be an annular band, is compressed in a direction parallel to its longitudinal axis and is bonded to a tire carcass, while being maintained under compression. This may be done by compressing a tread band into an undersized mould; apparatus for assisting this is also described. Alternatively, the tread strip may be of finite length, for example to form a lug, in which case the strip is formed with a radius of curvature less that of the surface to which it is to be applied, so that the convex (wearing) surface of the strip is compressed upon application to the carcass.
    Type: Grant
    Filed: August 30, 1974
    Date of Patent: June 22, 1976
    Assignee: Kentredder Limited
    Inventors: Peter Jan Kent, John Eric Phillips, Jan Herbert Farquharson Kent