Abstract: A three-dimensional capacitor is formed from a multilayer of superposed electrodes. The electrodes are formed within respective metallization levels of an integrated circuit. At least two additional superposed electrodes are formed on top of the multilayer. Each additional electrode is formed from a branched rectilinear structure including at least one bar aligned in a first direction and a plurality of branches extending from that at least one bar in a second direction.

Abstract: A method of estimating an electrical capacitance of a circuit component is carried out by decomposing the capacitance into a sum of terms associated with respective contributions from a central part and peripheral parts of the component. A component to which the method can be applied comprises two rectangular conducting plates placed parallel to each other. One of the two plates is greater than the other. The component furthermore includes two different dielectrics. A first dielectric covers the large plate and separates the two plates, and a second dielectric surrounds the first plate and the first dielectric. A method of defining a dimension of a capacitor is also presented.

Abstract: A method of estimating an electrical capacitance of a circuit component is carried out by decomposing the capacitance into a sum of terms associated with respective contributions from a central part and peripheral parts of the component. A component to which the method can be applied comprises two rectangular conducting plates placed parallel to each other. One of the two plates is greater than the other. The component furthermore includes two different dielectrics. A first dielectric covers the large plate and separates the two plates, and a second dielectric surrounds the first plate and the first dielectric. A method of defining a dimension of a capacitor is also presented.