Abstract: Various examples of a system for trimming and collecting plant material are described herein. In one aspect, the system can include a first and second workstation. The first workstation can include a first support frame and a containment portion. The containment portion may include a sidewall and a planar screen. The planar screen removably positioned at an angle within the sidewall. The second workstation can include a second support frame, a table portion, at least one drawer having a bottom may include a screen, and at least one bin. The table portion can include a planar screen table surface and a containment wall. The at least one drawer can be positioned between the planar screen table surface and the at least one bin, where the planar screen table surface can include a screen having openings sized greater than the screen of the bottom of the at least one drawer.

Abstract: A system for collecting and analyzing equipment telematic data typically includes a processor, a memory, and an analysis module stored in the memory. The analysis module is typically configured for: receiving telematic data from a piece of equipment; parsing the telematic data to identify (i) location information and (ii) usage information for one or more tools; analyzing the telematic data to determine whether a job site condition has been satisfied; in response to determining that the job site condition has been satisfied, identifying a first job site location based on the location information of the telematic data; determining that the first job site location is not within an existing job site; and updating a job site database to include the first job site location.

Abstract: Various examples of a system for trimming and collecting plant material are disclosed herein. In one aspect, the system can include a first and second workstation. The first workstation can include a first support frame and a containment portion. The containment portion may include a sidewall and a planar screen. The planar screen removably positioned at an angle within the sidewall. The second workstation can include a second support frame, a table portion, at least one drawer having a bottom may include a screen, and at least one bin. The table portion can include a planar screen table surface and a containment wall. The at least one drawer can be positioned between the planar screen table surface and the at least one bin, where the planar screen table surface can include a screen having openings sized greater than the screen of the bottom of the at least one drawer.

Abstract: A virtual reality system may comprise a head-mounted display comprising: a sensor for tracking an object, the sensor having a first field-of-view; an auxiliary sensor system coupled to the head-mounted display and having a second field-of-view, wherein the first field-of-view and the second field-of-view overlap to form a combined field-of-view. The head-mounted display may be configured to track a position of the object with the sensor; render the object in the virtual environment based on the position determined by the sensor; determine that the object has left the first field-of-view of the sensor and entered the second field-of-view associated with the auxiliary sensor system; in response to determining that the object has left the first field-of-view and entered the second field-of-view, track the position of the object with the auxiliary sensor system; and render the object in the virtual environment based on the position determined by the auxiliary sensor system.

Abstract: A system for collecting and analyzing equipment telematic data typically includes a processor, a memory, and an analysis module stored in the memory. The analysis module is typically configured for: receiving telematic data from a piece of equipment; parsing the telematic data to identify (i) location information and (ii) usage information for one or more tools; analyzing the telematic data to determine whether a job site condition has been satisfied; in response to determining that the job site condition has been satisfied, identifying a first job site location based on the location information of the telematic data; determining that the first job site location is not within an existing job site; and updating a job site database to include the first job site location.

Abstract: A virtual reality training and evaluation system may comprise a visual display device, one or more user input devices, one or more computer processors, a memory, and a network communication device. Computer-executable instructions are stored in the memory and configured to cause the one or more computer processors to execute a virtual reality training program that simulates a virtual environment displayed on the visual display device. A user is typically prompted to complete a task within the virtual environment. The task may be an electrical, gas, or water construction, maintenance, or service task. User interactions with the virtual environment in order to complete the task are received via the one or more user input devices. The user's performance of the task (and related subtasks) is typically monitored and compared to defined evaluation criteria. Thereafter, the user may be provided with an evaluation.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.