Abstract: Various examples of a system for trimming and collecting plant material are described herein. In one aspect, the system can include a first and second workstation. The first workstation can include a first support frame and a containment portion. The containment portion may include a sidewall and a planar screen. The planar screen removably positioned at an angle within the sidewall. The second workstation can include a second support frame, a table portion, at least one drawer having a bottom may include a screen, and at least one bin. The table portion can include a planar screen table surface and a containment wall. The at least one drawer can be positioned between the planar screen table surface and the at least one bin, where the planar screen table surface can include a screen having openings sized greater than the screen of the bottom of the at least one drawer.

Abstract: Various examples of a system for trimming and collecting plant material are disclosed herein. In one aspect, the system can include a first and second workstation. The first workstation can include a first support frame and a containment portion. The containment portion may include a sidewall and a planar screen. The planar screen removably positioned at an angle within the sidewall. The second workstation can include a second support frame, a table portion, at least one drawer having a bottom may include a screen, and at least one bin. The table portion can include a planar screen table surface and a containment wall. The at least one drawer can be positioned between the planar screen table surface and the at least one bin, where the planar screen table surface can include a screen having openings sized greater than the screen of the bottom of the at least one drawer.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

Abstract: An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.