Abstract: A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.

Abstract: A thermoelectric device includes a thermally conductive first plate and at least one thermoelectric sub-assembly comprises a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The at least one thermoelectric sub-assembly further includes a first material along a first portion of a perimeter of the region and having a first stiffness and a second material along a second portion of the perimeter of the region and having a second stiffness less than the first stiffness.

Abstract: A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.

Abstract: A thermoelectric device includes a thermally conductive first plate and at least one thermoelectric sub-assembly comprises a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The at least one thermoelectric sub-assembly further includes a first material along a first portion of a perimeter of the region and having a first stiffness and a second material along a second portion of the perimeter of the region and having a second stiffness less than the first stiffness.

Abstract: A thermoelectric device includes a thermally conductive first plate and a plurality of thermoelectric sub-assemblies, each having a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. At least some electrically conductive portions of the first plate are positioned at least partially outside the regions, in electrical communication with the plurality of thermoelectric sub-assemblies, and include a first electrically conductive portion and a second electrically conductive portion. The first electrically conductive portion is configured to be in electrical communication with an input electrical conduit and the second electrically conductive portion is configured to be in electrical communication with an output electrical conduit.

Abstract: Cartridge-based thermoelectric assemblies and systems are provided which include at least one shunt configured to extend around a conduit, a plurality of thermoelectric elements in thermal communication and in electrical communication with the at least one shunt with at least a portion of the at least one shunt sandwiched between the at least one first thermoelectric element and the at least one second thermoelectric element. The thermoelectric elements are electrically isolated from the conduit. The thermoelectric assemblies and systems further include at least one heat exchanger in thermal communication with the at least one shunt and configured to be in thermal communication with a second fluid.

Abstract: In certain embodiments, a thermoelectric assembly and method is provided that can be configured to be in thermal communication with a generally tubular first fluid conduit configured to allow a first fluid to flow through the first fluid conduit along a first direction. The thermoelectric assembly can extend at least partially around a perimeter of the first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another. Each thermoelectric sub-assembly can also include at least one shunt comprising a first portion and a second portion. The first portion can be in thermal communication with and mechanically coupled to the plurality of thermoelectric elements and be in thermal communication with at least one second fluid conduit.

Abstract: A thermoelectric assembly and method are provided. The thermoelectric assembly can extend at least partially around a perimeter of a first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another, and at least one shunt a plurality of electrically insulating elements to prevent current flow in a plane perpendicular to the first direction between adjacent thermoelectric sub-assemblies.

Abstract: A thermoelectric assembly and a method of operating a thermoelectric assembly are provided. The thermoelectric assembly includes at least one thermoelectric subassembly configured to be in thermal communication with a heat source and configured to be in thermal communication with a heat sink. The at least one thermoelectric subassembly includes at least one thermoelectric element including a hot side at a first temperature and a cold side at a second temperature lower than the first temperature. The thermoelectric assembly further includes a controller in operative communication with the at least one thermoelectric subassembly. The controller is configured to adjust the first temperature by adjusting an electrical current of the at least one thermoelectric subassembly.

Abstract: A thermoelectric system includes at least one first heat exchanger configured to be in thermal communication with a heat source, at least one second heat exchanger configured to be in thermal communication with a heat sink, and at least one thermoelectric assembly including a plurality of thermoelectric elements sealed within an environment including a gas. The at least one thermoelectric assembly is mechanically coupled to the at least one first heat exchanger and mechanically coupled to the at least one second heat exchanger. The at least one thermoelectric assembly is sandwiched between the at least one first heat exchanger and the at least one second heat exchanger. The at least one second heat exchanger includes at least one mechanically compliant element configured to flex in response to at least one dimensional change of the at least one thermoelectric assembly due to thermal expansion or contraction.

Abstract: Cartridge-based thermoelectric assemblies and systems are provided which include at least one shunt configured to extend around a conduit, a plurality of thermoelectric elements in thermal communication and in electrical communication with the at least one shunt with at least a portion of the at least one shunt sandwiched between the at least one first thermoelectric element and the at least one second thermoelectric element. The thermoelectric elements are electrically isolated from the conduit. The thermoelectric assemblies and systems further include at least one heat exchanger in thermal communication with the at least one shunt and configured to be in thermal communication with a second fluid.

Abstract: A thermoelectric assembly and method are provided. The thermoelectric assembly can extend at least partially around a perimeter of a first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another, and a plurality of electrically insulating elements to prevent current flow in a plane perpendicular to the first direction between adjacent thermoelectric sub-assemblies.