Patents by Inventor Eric Pucilowski

Eric Pucilowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10590661
    Abstract: Methods, systems and polished overlays utilizing an uncoupling membrane between a substrate (e.g., floor) and a deposited polishable overlay. The overlay may be a self-leveling, polishable overlay. An uncoupling membrane is secured to a substrate followed by directly depositing a polishable overlay over and contacting the uncoupling membrane. The uncoupling membrane secures the polishable overlay to the substrate without use of a primer/broadcast sand layer. The polishable overlay may fill voids in the uncoupling membrane and may be deposited over the uncoupling membrane to a thickness residing above a top surface of the uncoupling membrane. The polishable overlay may be polished once cured whereby the uncoupling membrane reduces stresses in the overlay layer during polishing.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: March 17, 2020
    Assignee: Laticrete International Inc.
    Inventor: Eric Pucilowski
  • Publication number: 20190100925
    Abstract: Methods, systems and polished overlays utilizing an uncoupling membrane between a substrate (e.g., floor) and a deposited polishable overlay. The overlay may be a self-leveling, polishable overlay. An uncoupling membrane is secured to substrate followed by directly depositing a polishable overlay over and contacting the uncoupling membrane. The uncoupling membrane secures the polishable overlay to the substrate without use of a primer/broadcast sand layer. The polishable overlay may fill voids in the uncoupling membrane and may be deposited over the uncoupling membrane to a thickness residing above a top surface of the uncoupling membrane. The polishable overlay may be polished once cured whereby the uncoupling membrane reduces stresses in the overlay layer during polishing.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 4, 2019
    Inventor: Eric Pucilowski