Patents by Inventor Eric R. Daniel

Eric R. Daniel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Land grid array socket assembly
    Patent number: 9060436
    Abstract: A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: June 16, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric R. Daniel
  • LAND GRID ARRAY SOCKET ASSEMBLY
    Publication number: 20130208410
    Abstract: A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.
    Type: Application
    Filed: October 28, 2010
    Publication date: August 15, 2013
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric R. Daniel
  • Versatile printed circuit board for testing processing reliability
    Patent number: 6040530
    Abstract: A printed circuit board can be used as a test card. The printed circuit board has a first image and a second image. The first image includes a first array pattern for attaching a package, a first power plane, and a first ground plane. The second image includes a second array pattern for attaching a package, a second power plane, and a second ground plane. A first routing area between the first image and the second image electrically and physically isolates the first power plane from the second power plane. The first routing area also physically isolates the first ground plane from the second ground plane. A first single trace extends through the first routing area. The first single trace electrically connects the first ground plane to the second ground plane.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: March 21, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Robert J. Wharton, Eric R. Daniel, Joseph D. Brown